激光成形技术:全面检讨的机制,工艺优化,和工业应用

IF 2.6 3区 材料科学 Q2 ENGINEERING, MANUFACTURING
El-Said Salah, Rania Mostafa, M. M. Tawfik, Montasser Dewidar
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引用次数: 0

摘要

激光成形(LF)是一种先进的非接触制造技术,利用激光能量诱导金属板的受控热膨胀和塑性变形,使高强度脆性材料的成型具有最小的残余应力。LF的有效性受三种主要机制(温度梯度机制(TGM)、屈曲机制(BM)和镦粗机制(UM))的影响,这三种机制受激光功率、扫描速度、光束直径和材料性能等工艺参数的影响。本文综述了LF的最新进展,首先分析了控制变形机制及其在实现精度和控制方面的作用。然后探讨关键的微观结构变化,包括晶粒细化,相变和热影响区(HAZ),直接影响材料的行为和性能。在这些基础方面的基础上,本文重点介绍了通过基于机器学习(ML)的优化、实时热反馈和自适应控制策略来增强LF过程的当前创新。讨论了诸如边缘效应、残余应力和过程可重复性等挑战,以及强制冷却和自适应扫描等缓解方法。实验结果表明,强制冷却可使弯曲角增大35.2%,提高能源效率22.14%。本文进一步探讨了人工神经网络、支持向量机和气体等计算模型在预测弯曲角度和优化工艺参数方面的应用。例如,基于人工神经网络的模型的预测准确率高达98.9%。人工智能工具为未来的研究方向提供了一个整体的视角,旨在提高过程的可持续性和更广泛的工业采用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Laser forming technology: a comprehensive review of mechanisms, process optimization, and industrial applications

Laser forming (LF) is an advanced non-contact manufacturing technique that utilizes laser energy to induce controlled thermal expansion and plastic deformation in metal sheets, enabling the shaping of high-strength and brittle materials with minimal residual stresses. The effectiveness of LF is governed by three primary mechanisms Temperature Gradient Mechanism (TGM), Buckling Mechanism (BM), and Upsetting Mechanism (UM)) which are influenced by process parameters such as laser power, scanning speed, beam diameter, and material properties. This review presents a comprehensive overview of recent advancements in LF, beginning with an analysis of the governing deformation mechanisms and their role in achieving precision and control. It then explores critical microstructural changes including grain refinement, phase transformations, and heat-affected zones (HAZ) that directly impact material behavior and performance. Building upon these foundational aspects, the article highlights current innovations in LF process enhancement through machine learning (ML)-based optimization, real-time thermal feedback, and adaptive control strategies. Challenges such as edge effects, residual stresses, and process repeatability are discussed, along with mitigation approaches Like forced cooling and adaptive scanning. Experimental findings show that forced cooling can increase the bending angle by up to 35.2% and improve energy efficiency by 22.14%. The review Further examines the application of computational models such as ANNs, SVMs, and GAs in predicting bend angles and optimizing process parameters. ANN-based models, for instance, have achieved prediction accuracies of up to 98.9%. The AI tools offer a holistic perspective on future research directions aimed at enhancing process sustainability and broader industrial adoption.

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来源期刊
International Journal of Material Forming
International Journal of Material Forming ENGINEERING, MANUFACTURING-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
5.10
自引率
4.20%
发文量
76
审稿时长
>12 weeks
期刊介绍: The Journal publishes and disseminates original research in the field of material forming. The research should constitute major achievements in the understanding, modeling or simulation of material forming processes. In this respect ‘forming’ implies a deliberate deformation of material. The journal establishes a platform of communication between engineers and scientists, covering all forming processes, including sheet forming, bulk forming, powder forming, forming in near-melt conditions (injection moulding, thixoforming, film blowing etc.), micro-forming, hydro-forming, thermo-forming, incremental forming etc. Other manufacturing technologies like machining and cutting can be included if the focus of the work is on plastic deformations. All materials (metals, ceramics, polymers, composites, glass, wood, fibre reinforced materials, materials in food processing, biomaterials, nano-materials, shape memory alloys etc.) and approaches (micro-macro modelling, thermo-mechanical modelling, numerical simulation including new and advanced numerical strategies, experimental analysis, inverse analysis, model identification, optimization, design and control of forming tools and machines, wear and friction, mechanical behavior and formability of materials etc.) are concerned.
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