An Artificial Piezoelectric-Conductive Integrated Peri-Implant Gingiva Enables Efficient Bacterial Inhibition and Soft-Tissue Integration

Peri-implantitis is the main reason for dental implant failure. Optimizing electroactivity at the interface between dental implants and tissue is essential for enhancing integration and preventing bacterial invasion. Here, a bioinspired piezoelectric-conductive integrated peri-implant gingiva (PiG) with simultaneously enhanced antibacterial efficacy and soft-tissue integration, which is based on a flexible piezoelectric film and conductive polymer network, is presented. The piezoelectricity of PiG is achieved through the electrospinning of polyvinylidene fluoride/BaTiO₃/MXene on a polydopamine-modified plasma-activated Ti surface, whereas the conductive property of PiG is achieved by the in situ polymerization of 3,4-ethylenedioxythiophene monomers. Under ultrasonic irradiation, PiG can promote the formation of neutrophil extracellular traps and reactive oxygen species, thus achieving synergistic and efficient piezodynamic killing of Staphylococcus aureus (S. aureus) and Escherichia coli (E. coli). Additionally, piezoelectricity-enabled electrical stimulation endows PiG with enhanced fibroblasts adhesion, proliferation, and collagen secretion. As a demonstration, ultrasound irradiation of PiG-grafted Ti implanted in a subcutaneous implantation rat model efficiently eliminates the S. aureus infection and rescues the implant with increased soft-tissue integration. The concept of an artificial PiG is anticipated to open new avenues for the development of high-performance implant materials, potentially extending their lifespans.

Graphical abstract