{"title":"微孔镀铜中环保抑制剂间化合物的应用","authors":"Zewei Lin, Zhihua Tao, Yuxuan Huang, Jihua Zhang","doi":"10.1007/s12678-025-00960-8","DOIUrl":null,"url":null,"abstract":"<div><p>Tween (TW) compounds, on account of their environmentally benign and non-toxic characteristics, were systematically studied as prospective eco-friendly suppressants in the process of copper plating for blind hole filling. The synergistic effects between TW and other additives were verified by means of chronopotentiometry, cyclic voltammetry, and electrochemical impedance spectroscopy. The outcomes of the electrochemical tests revealed that the competitive adsorption behavior between bis-(3-sulfopropyl) disulfide (SPS) and TW is contingent upon the current density and the intensity of convection. Metallographic section analysis demonstrated that TW exhibits outstanding microvia filling capabilities for micro blind vias with a diameter of 150 µm and a depth of 80 µm. Notably, TW-80 was able to attain a filling rate of 96.15% following electrodeposition for 60 min at a current density of 2 A/dm<sup>2</sup>. Quantum chemical calculations suggested that the relatively smaller band gap and the clustered molecular structure of TW-80 are more conducive to its adsorption onto the electrode surface, leading to the formation of a barrier layer, which in turn restrains the deposition of copper.</p><h3>Graphical Abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":535,"journal":{"name":"Electrocatalysis","volume":"16 5","pages":"828 - 843"},"PeriodicalIF":2.8000,"publicationDate":"2025-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Tween Compounds as Eco-Friendly Suppressors for Acid Copper Electroplating Applications of Microvia\",\"authors\":\"Zewei Lin, Zhihua Tao, Yuxuan Huang, Jihua Zhang\",\"doi\":\"10.1007/s12678-025-00960-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Tween (TW) compounds, on account of their environmentally benign and non-toxic characteristics, were systematically studied as prospective eco-friendly suppressants in the process of copper plating for blind hole filling. The synergistic effects between TW and other additives were verified by means of chronopotentiometry, cyclic voltammetry, and electrochemical impedance spectroscopy. The outcomes of the electrochemical tests revealed that the competitive adsorption behavior between bis-(3-sulfopropyl) disulfide (SPS) and TW is contingent upon the current density and the intensity of convection. Metallographic section analysis demonstrated that TW exhibits outstanding microvia filling capabilities for micro blind vias with a diameter of 150 µm and a depth of 80 µm. Notably, TW-80 was able to attain a filling rate of 96.15% following electrodeposition for 60 min at a current density of 2 A/dm<sup>2</sup>. Quantum chemical calculations suggested that the relatively smaller band gap and the clustered molecular structure of TW-80 are more conducive to its adsorption onto the electrode surface, leading to the formation of a barrier layer, which in turn restrains the deposition of copper.</p><h3>Graphical Abstract</h3>\\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":535,\"journal\":{\"name\":\"Electrocatalysis\",\"volume\":\"16 5\",\"pages\":\"828 - 843\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-05-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrocatalysis\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s12678-025-00960-8\",\"RegionNum\":4,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrocatalysis","FirstCategoryId":"92","ListUrlMain":"https://link.springer.com/article/10.1007/s12678-025-00960-8","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
摘要
由于Tween （TW）化合物具有环保、无毒的特点，对其作为有前景的环保抑制剂在镀铜补盲孔工艺中的应用进行了系统的研究。通过时间电位法、循环伏安法和电化学阻抗谱等方法验证了TW与其他添加剂之间的协同作用。电化学测试结果表明，双-（3-磺基丙基）二硫化物（SPS）与TW的竞争吸附行为取决于电流密度和对流强度。金相切片分析表明，对于直径为150µm，深度为80µm的微盲孔，TW具有出色的微孔填充能力。值得注意的是，在2 a /dm2的电流密度下电沉积60分钟后，TW-80能够达到96.15%的填充率。量子化学计算表明，TW-80相对较小的带隙和簇状分子结构更有利于其吸附在电极表面，从而形成阻挡层，从而抑制了铜的沉积。图形抽象
Tween Compounds as Eco-Friendly Suppressors for Acid Copper Electroplating Applications of Microvia
Tween (TW) compounds, on account of their environmentally benign and non-toxic characteristics, were systematically studied as prospective eco-friendly suppressants in the process of copper plating for blind hole filling. The synergistic effects between TW and other additives were verified by means of chronopotentiometry, cyclic voltammetry, and electrochemical impedance spectroscopy. The outcomes of the electrochemical tests revealed that the competitive adsorption behavior between bis-(3-sulfopropyl) disulfide (SPS) and TW is contingent upon the current density and the intensity of convection. Metallographic section analysis demonstrated that TW exhibits outstanding microvia filling capabilities for micro blind vias with a diameter of 150 µm and a depth of 80 µm. Notably, TW-80 was able to attain a filling rate of 96.15% following electrodeposition for 60 min at a current density of 2 A/dm2. Quantum chemical calculations suggested that the relatively smaller band gap and the clustered molecular structure of TW-80 are more conducive to its adsorption onto the electrode surface, leading to the formation of a barrier layer, which in turn restrains the deposition of copper.
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Electrocatalysis is cross-disciplinary in nature, and attracts the interest of chemists, physicists, biochemists, surface and materials scientists, and engineers. Electrocatalysis provides the unique international forum solely dedicated to the exchange of novel ideas in electrocatalysis for academic, government, and industrial researchers. Quick publication of new results, concepts, and inventions made involving Electrocatalysis stimulates scientific discoveries and breakthroughs, promotes the scientific and engineering concepts that are critical to the development of novel electrochemical technologies.
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