钼与液态锡在1050℃时的相容性:理论估计与实验观察的比较

IF 0.9 4区 物理与天体物理 Q4 PHYSICS, APPLIED
V. P. Krasin, A. V. Vertkov, S. I. Soyustova
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引用次数: 0

摘要

液态锡被认为是一种很有前途的等离子体表面材料,可用于固定式核聚变反应堆的腔内组件。由于液态锡中的腐蚀主要是由于固体金属在液态锡中的溶解,因此结构材料主要组分的溶解度和热力学活性是理解腐蚀过程的关键参数。对过渡金属Fe、Cr、Nb、Mo、W在液态锡中的溶解度进行了理论计算,并与文献中的实验数据进行了比较。报道了钼与液态锡在1050℃时的相容性实验结果。所得结果与计算估计吻合较好,为在类似于室内托卡马克元件的条件下,在更广泛的时间基础上继续进行研究提供了乐观的基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Compatibility of Molybdenum with Liquid Tin at 1050°C: Comparison of Theoretical Estimates with Experimental Observations

Compatibility of Molybdenum with Liquid Tin at 1050°C: Comparison of Theoretical Estimates with Experimental Observations

Liquid tin is considered to be a promising plasma-facing material used in intra-chamber components of a stationary fusion reactor. Since corrosion in liquid tin is largely due to dissolution of solid metals in liquid tin, the solubility and thermodynamic activity of the main components of the structural material are key parameters for understanding corrosion processes. The solubility of the transition metals Fe, Cr, Nb, Mo, and W in liquid tin has been theoretically calculated and the results obtained have been compared with the experimental data from the literature. The results of experiments on the compatibility of molybdenum with liquid tin at 1050°C are reported. The results obtained agree well with the computational estimate and provide an optimistic basis for continuing the investigations on a wider time basis under the conditions similar to those for in-chamber tokamak components.

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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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