{"title":"覆盖FGPS层的压电半导体夹层圆柱壳的动力响应","authors":"Changsong Zhu, Ziqi Xu, Jinxi Liu","doi":"10.1007/s10999-025-09757-5","DOIUrl":null,"url":null,"abstract":"<div><p>This paper focuses on the linear dynamic responses of a piezoelectric semiconductor (PS) sandwich cylindrical shell covered with functionally graded piezoelectric semiconductor (FGPS) layers. The PS sandwich cylindrical shell is composed of a PS core layer and two FGPS surface layers. The FGPS surface layer consists of the metal material (i.e., aluminum) and piezoelectric semiconductor material (i.e., zinc oxide). According to the virtual work, strain energy as well as kinetic energy of the FGPS sandwich cylindrical shell, the vibration governing differential equations are achieved on the basis of Hamilton’s principle. Then the theoretical solutions of the vibration responses are obtained by solving the governing equations with Navier method. Through numerical examples, the effect of the functionally graded index, thickness ratio, initial electron concentration and excitation frequency on the dynamic responses of the FGPS sandwich cylindrical shell is analyzed. The main novelty of the manuscript is that the induced electric potential, perturbation of electron concentration and radial displacement of the FGPS sandwich cylindrical shell may be regulated effectively by designing a proper initial electron concentration and applying an appropriate excitation frequency. The multi-field coupling mechanism among carrier, polarization as well as deformation is demonstrated. The current outcomes also show that the geometric parameter, circumference wave number and functionally graded index have a significant effect on the vibration frequency and damping characteristic of the FGPS sandwich cylindrical shell.</p></div>","PeriodicalId":593,"journal":{"name":"International Journal of Mechanics and Materials in Design","volume":"21 4","pages":"679 - 699"},"PeriodicalIF":3.6000,"publicationDate":"2025-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dynamic responses of a piezoelectric semiconductor sandwich cylindrical shell covered with FGPS layers\",\"authors\":\"Changsong Zhu, Ziqi Xu, Jinxi Liu\",\"doi\":\"10.1007/s10999-025-09757-5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This paper focuses on the linear dynamic responses of a piezoelectric semiconductor (PS) sandwich cylindrical shell covered with functionally graded piezoelectric semiconductor (FGPS) layers. The PS sandwich cylindrical shell is composed of a PS core layer and two FGPS surface layers. The FGPS surface layer consists of the metal material (i.e., aluminum) and piezoelectric semiconductor material (i.e., zinc oxide). According to the virtual work, strain energy as well as kinetic energy of the FGPS sandwich cylindrical shell, the vibration governing differential equations are achieved on the basis of Hamilton’s principle. Then the theoretical solutions of the vibration responses are obtained by solving the governing equations with Navier method. Through numerical examples, the effect of the functionally graded index, thickness ratio, initial electron concentration and excitation frequency on the dynamic responses of the FGPS sandwich cylindrical shell is analyzed. The main novelty of the manuscript is that the induced electric potential, perturbation of electron concentration and radial displacement of the FGPS sandwich cylindrical shell may be regulated effectively by designing a proper initial electron concentration and applying an appropriate excitation frequency. The multi-field coupling mechanism among carrier, polarization as well as deformation is demonstrated. The current outcomes also show that the geometric parameter, circumference wave number and functionally graded index have a significant effect on the vibration frequency and damping characteristic of the FGPS sandwich cylindrical shell.</p></div>\",\"PeriodicalId\":593,\"journal\":{\"name\":\"International Journal of Mechanics and Materials in Design\",\"volume\":\"21 4\",\"pages\":\"679 - 699\"},\"PeriodicalIF\":3.6000,\"publicationDate\":\"2025-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Mechanics and Materials in Design\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10999-025-09757-5\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Mechanics and Materials in Design","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10999-025-09757-5","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Dynamic responses of a piezoelectric semiconductor sandwich cylindrical shell covered with FGPS layers
This paper focuses on the linear dynamic responses of a piezoelectric semiconductor (PS) sandwich cylindrical shell covered with functionally graded piezoelectric semiconductor (FGPS) layers. The PS sandwich cylindrical shell is composed of a PS core layer and two FGPS surface layers. The FGPS surface layer consists of the metal material (i.e., aluminum) and piezoelectric semiconductor material (i.e., zinc oxide). According to the virtual work, strain energy as well as kinetic energy of the FGPS sandwich cylindrical shell, the vibration governing differential equations are achieved on the basis of Hamilton’s principle. Then the theoretical solutions of the vibration responses are obtained by solving the governing equations with Navier method. Through numerical examples, the effect of the functionally graded index, thickness ratio, initial electron concentration and excitation frequency on the dynamic responses of the FGPS sandwich cylindrical shell is analyzed. The main novelty of the manuscript is that the induced electric potential, perturbation of electron concentration and radial displacement of the FGPS sandwich cylindrical shell may be regulated effectively by designing a proper initial electron concentration and applying an appropriate excitation frequency. The multi-field coupling mechanism among carrier, polarization as well as deformation is demonstrated. The current outcomes also show that the geometric parameter, circumference wave number and functionally graded index have a significant effect on the vibration frequency and damping characteristic of the FGPS sandwich cylindrical shell.
期刊介绍:
It is the objective of this journal to provide an effective medium for the dissemination of recent advances and original works in mechanics and materials'' engineering and their impact on the design process in an integrated, highly focused and coherent format. The goal is to enable mechanical, aeronautical, civil, automotive, biomedical, chemical and nuclear engineers, researchers and scientists to keep abreast of recent developments and exchange ideas on a number of topics relating to the use of mechanics and materials in design.
Analytical synopsis of contents:
The following non-exhaustive list is considered to be within the scope of the International Journal of Mechanics and Materials in Design:
Intelligent Design:
Nano-engineering and Nano-science in Design;
Smart Materials and Adaptive Structures in Design;
Mechanism(s) Design;
Design against Failure;
Design for Manufacturing;
Design of Ultralight Structures;
Design for a Clean Environment;
Impact and Crashworthiness;
Microelectronic Packaging Systems.
Advanced Materials in Design:
Newly Engineered Materials;
Smart Materials and Adaptive Structures;
Micromechanical Modelling of Composites;
Damage Characterisation of Advanced/Traditional Materials;
Alternative Use of Traditional Materials in Design;
Functionally Graded Materials;
Failure Analysis: Fatigue and Fracture;
Multiscale Modelling Concepts and Methodology;
Interfaces, interfacial properties and characterisation.
Design Analysis and Optimisation:
Shape and Topology Optimisation;
Structural Optimisation;
Optimisation Algorithms in Design;
Nonlinear Mechanics in Design;
Novel Numerical Tools in Design;
Geometric Modelling and CAD Tools in Design;
FEM, BEM and Hybrid Methods;
Integrated Computer Aided Design;
Computational Failure Analysis;
Coupled Thermo-Electro-Mechanical Designs.