通过剪切耦合解释镁合金退火过程中的不规则晶粒旋转

IF 5.6 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Scripta Materialia Pub Date : 2025-09-26 DOI:10.1016/j.scriptamat.2025.117005

Matthew R. Barnett , Jun Wang , Yu Chen , Ross K.W. Marceau , Runguang Li , Peter Lynch , Scott Barnett , Andrew Stevenson

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引用次数: 0

摘要

我们观察到镁合金AZ91在500℃退火过程中出现了不稳定的晶粒旋转。这证实了Liss等人最近报告的一项发现。物质学报，2024,26(4),2300470 [j]。然而，我们证明了不稳定的旋转实际上并不是完全不稳定的。在所研究的情况下，旋转遵循不同的时间片段，其特征是共同的旋转轴和共同的剪切耦合因子（通过比较颗粒旋转与x射线劳埃斑强度变化来推断）。虽然在某些三联结和晶界处存在一小部分熔融相加剧了这一现象，这减少了对晶粒旋转的约束，但其主要特征可以用断裂介导的剪切耦合来充分解释。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Erratic grain rotation during annealing of a Mg alloy interpreted via shear-coupling

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Erratic grain rotation during annealing of a Mg alloy interpreted via shear-coupling

We present an observation of erratic grain rotation in Mg alloy AZ91 during annealing at 500 °C. This confirms a finding reported recently by Liss et al. [Adv. Eng. Mater. 2024, 26(4), 2300470]. However, we show that the erratic rotation is actually not completely erratic. For the cases examined, rotation follows distinct segments in time characterised by a common rotation axis and a common shear coupling factor (inferred by comparing grain rotation with X-ray Laue spot intensity change). While the phenomenon is accentuated by the presence of a small fraction of molten phase at certain triple junctions and grain boundaries, which reduces constraint against grain rotation, its key features can be adequately explained in terms of disconnection-mediated shear coupling.

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来源期刊

Scripta Materialia 工程技术-材料科学：综合

CiteScore

11.40

自引率

5.00%

发文量

581

审稿时长

34 days

期刊介绍： Scripta Materialia is a LETTERS journal of Acta Materialia, providing a forum for the rapid publication of short communications on the relationship between the structure and the properties of inorganic materials. The emphasis is on originality rather than incremental research. Short reports on the development of materials with novel or substantially improved properties are also welcomed. Emphasis is on either the functional or mechanical behavior of metals, ceramics and semiconductors at all length scales.