扫描纳米压痕法测定落叶树年轮力学特性的分布

IF 0.9 4区 物理与天体物理 Q4 PHYSICS, APPLIED
Yu. I. Golovin, A. I. Tyurin, A. A. Gusev, S. M. Matveev, D. Yu. Golovin, I. A. Vasyukova
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引用次数: 0

摘要

摘要/ abstract摘要:本文介绍了利用纳米压痕技术对落叶树木材,特别是小叶石灰(Tilia cordata)和普通橡树(Quercus robur)的年轮进行力学特性扫描的结果。显微硬度H和杨氏模量E径向依赖性的显著变化已被发现的任何研究物种。研究结果可用于(1)修正对各种木材宏观力学性质的理解,揭示其微观结构特征的形成细节;(2)优化木材的生长、加固和后续使用技术;(3)在树木年代学和树木气候学中开发新的独立方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Distribution of Mechanical Properties in Annual Growth Rings of Deciduous Trees Measured Using Scanning Nanoindentation

Distribution of Mechanical Properties in Annual Growth Rings of Deciduous Trees Measured Using Scanning Nanoindentation

Abstract—The paper presents the results of mechanical properties scanning by means of nanoindentation across the annual growth rings of deciduous trees wood, small-leaved lime (Tilia cordata) and common oak (Quercus robur) in particular. Significant variations in microhardness H and Young’s modulus E radial dependencies have been found for any of the studied species. Results can be useful (1) to amend the understanding the nature of macromechanical properties of various wood species and to reveal the details of their formation depending upon microstructural characteristics, (2) to optimize the technologies of growing, reinforcement and subsequent usage of the wood, (3) to develop new independent methods in dendrochronology and dendroclimatology.

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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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