硅橡胶中100µm尺度深层和横向缺陷的太赫兹成像。

Applied optics Pub Date : 2025-09-01 DOI:10.1364/AO.572596
Da-Hye Choi
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引用次数: 0

摘要

高压电力电缆对于远距离能量传输是必不可少的,其中接头和终端的绝缘可靠性尤为关键。硅橡胶(SiR)等聚合物材料被广泛使用,但它们仍然容易受到内部缺陷的影响,例如空气空洞和水分,这些缺陷会降低性能并导致故障。传统的非破坏性评估方法,包括超声波检测、x射线成像和局部放电测量,在分辨率、安全性或现场适用性方面存在局限性。太赫兹(THz)成像已经成为一种有前途的替代方案,提供非接触式、高分辨率的检测,对水分敏感。先前对聚合物绝缘体的太赫兹研究表明,在深度或横向方向上可以检测到100 μ m规模的缺陷,而沿着其他维度的缺陷尺寸通常保持在毫米范围内。据我们所知,目前还无法同时检测到聚合物绝缘体中两个方向上100 μ m的亚表面缺陷。本研究证明了使用基于固体浸没透镜的太赫兹时域光谱系统可视化大块SiR绝缘内部缺陷的可行性。在表面附近,深度和横向上小至100µm的空洞缺陷都被清晰地解决了。此外,厚度为100 μ m,横向直径为数百微米的空洞缺陷在深度达1mm时也可以检测到。此外,对由空洞和金属夹杂物组成的层状缺陷进行了成像,揭示了空洞之外的包裹物清晰地分解,由于空气界面的高反射率,使用超声波检查无法获得结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Terahertz imaging of 100  µm scale subsurface defects in both depth and lateral directions in silicone rubber.

High-voltage power cables are essential for long-distance energy transmission, where insulation reliability is especially critical at joints and terminations. Polymeric materials, such as silicone rubber (SiR), are widely used, but they remain vulnerable to internal defects, such as air voids and moisture, which can degrade performance and cause failure. Conventional non-destructive evaluation methods, including ultrasonic testing, X-ray imaging, and partial discharge measurements, have limitations in resolution, safety, or field applicability. Terahertz (THz) imaging has emerged as a promising alternative, offering non-contact, high-resolution inspection with sensitivity to moisture. Previous THz studies on polymeric insulators have demonstrated detection of 100 µm scale defects in either the depth or lateral direction, while the defect size along the other dimension typically remained in the millimeter range. To the best of our knowledge, the simultaneous detection of subsurface defects on the order of 100 µm in both directions within polymeric insulators has not yet been achieved. This study demonstrates the feasibility of visualizing internal defects within bulk SiR insulation using a solid immersion lens-based THz time-domain spectroscopy system. Void defects as small as 100 µm in both depth and lateral directions were clearly resolved near the surface. In addition, void defects with a thickness of 100 µm and lateral diameters of several hundred micrometers were detectable at depths up to 1 mm. Furthermore, a layered defect comprising a void and a metallic inclusion was imaged, revealing the inclusion clearly resolved beyond the void, a result unattainable using ultrasonic inspection due to high reflectivity at air interfaces.

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