可调环模激光束激光焊接2024铝合金与连续CFR-PEEK的界面键合机制

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Hua Liu , Huaxia Zhao , Yafeng Zhao , Yuanjie Peng , Mengjia Xu , Xiuhua Chen
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引用次数: 0

摘要

连续碳纤维增强聚醚醚酮(CFR-PEEK)/铝(Al)合金非均相复合接头是将CFR-PEEK与铝合金的优异性能有机结合的理想接头,而激光焊接技术是连接CFR-PEEK与铝合金的关键方法,具有精度高、效率高等优点。然而,不同材料在物理化学性能上的固有差异和焊接机理的不明确限制了其在CFR-PEEK/Al合金复合接头中的应用,而激光的高能量密度和热塑性材料的热敏性显著导致CFR-PEEK/Al合金连接的热风险。因此,本工作首先在氩气气氛下建立了CFR-PEEK与铝合金的直接连接,并通过密度泛函理论(DFT)模拟构建界面吸附模型,进一步研究了非氧化铝合金与CFR-PEEK各晶面的界面结合机理。首次采用分子动力学(MD)模拟和有限元(FE)模拟相结合的方法,探讨了CFR-PEEK与铝合金的界面动力学行为和适宜的界面温度。此外,本研究首次引入了一种芯/环功率比可调的可调环模(ARM)激光束,以优化CFR-PEEK与高强度2024铝合金焊接过程中的热输入。结果表明,PEEK可以与Al(111)、(001)和(110)晶面形成共价键,涉及Al 3p和O 2p轨道之间的强轨道杂化和电子从Al原子转移到电负性的O原子。在吸附阶段,在750 K时,相互作用能增长最快。在有限元模拟的指导下,将CFR-PEEK/2024 Al复合接头的界面温度选择为750 K,实验结果表明CFR-PEEK/2024 Al复合接头具有优异的抗拉剪切强度,验证了优化参数的有效性和仿真-实验相结合方法的可靠性。这些研究结果阐明了CFRTP/Al合金接头的结合特性和机理,为优化cfrp - peek与Al合金的焊接工艺提供了理论框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Interfacial bonding mechanisms in laser welding of 2024 Al alloy and continuous CFR-PEEK via adjustable ring-mode laser beam
Continuous carbon-fiber-reinforced polyether-ether-ketone (CFR-PEEK)/aluminum (Al) alloy heterogeneous composite joint provides a promising integration of the excellent properties of CFR-PEEK and Al alloy, and laser welding technology serves as a critical method for joining CFR-PEEK and Al alloy, offering advantages in high accuracy and efficiency. However, the inherent differences in physical and chemical properties of dissimilar materials and unclear welding mechanism limit its use in fabricating CFR-PEEK/Al alloy composite joints, and the high energy density of laser and the heat sensitivity of thermoplastic materials significantly leads to thermal risk of the joining of CFR-PEEK/Al alloy. Therefore, this work firstly established a direct joining of CFR-PEEK with Al alloy in an argon atmosphere, and further investigate interfacial bonding mechanism of various crystal planes of non-oxidized Al alloys and CFR-PEEK by interface adsorption model constructed through density functional theory (DFT) simulation, and firstly using the combined method of molecular dynamics (MD) simulation and finite element (FE) simulation to explore the interface dynamic behaviors and suitable interface temperature of CFR-PEEK and Al alloy. Furthermore, this study firstly introduced an adjustable-ring-mode (ARM) laser beam with an adjustable core/ring power ratio to optimize the heat input during welding of CFR-PEEK and high-strength 2024 Al alloy. Results indicated that PEEK could form covalent bonds with Al (111), (001), and (110) crystal planes, involving strong orbital hybridization between Al 3p and O 2p orbitals and electron transfer from Al atoms to electronegative O atoms. Furthermore, the thermal effects could be significant and precise influenced by the ARM laser beam, During the adsorption stage, the interaction energy increased most rapidly at 750 K. Guided by FE simulations, a 750 K interface temperature was selected for CFR-PEEK/2024 Al hybrid joints, and experiments demonstrated superior tensile shear strength, confirming the effectiveness of the optimized parameters and the reliability of the combined simulation-experimental approach. These findings elucidate the bonding characteristics and mechanisms of CFRTP/Al alloy joints, providing a theoretical framework for optimizing the welding process of CFR-PEEK and Al alloy.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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