丁二酸酐改性DeSC的制备与表征

IF 4.7 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Wangda Lu , Yi Wu , Xuepeng Zhang , Xiaoran Sun , Hongzhou Shang
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引用次数: 0

摘要

基于病变组织微环境pH呈弱酸性,且谷胱甘肽含量高于正常组织数倍的事实,以葡聚糖(dextran, Dex)为基质,设计了pH/氧化物还原药物缓释载体。以SA为底物,以葡聚糖为底物,将Dex羧化,再与Cys酰胺化,通过溶液挥发法自组装成纳米颗粒,制备了DeSC载体材料。以Cur为药物模型,采用搅拌方式进行载药率和包封率时,w的最大值分别为14.06±0.37%和54.54±1.7%;当给药比为1:5时,w的最大值分别为13.75±0.48%和68.18±3.33%。在体外模拟释药实验中,Cur@DeSC的累积释药率随pH的降低而升高,在pH = 5.5时达到最大值48.2±2.04%;溶血率低于5%,细胞存活率高于85%,表明DeSC纳米颗粒具有良好的生物安全性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation and characterization of DeSC modified using succinic anhydride
Based on the weakly acidic pH of the microenvironment of diseased tissues and the fact that glutathione content is several times higher than that of normal tissues, a pH/oxide-reduced drug slow-release carrier was designed using dextran (Dex) as a matrix.
The carrier material DeSC was prepared by carboxylating Dex using SA with dextran as a substrate, followed by amidation reaction with Cys, and self-assembled into nanoparticles using solution volatilization method. Using Cur as the drug model, the maximum values of 14.06 ± 0.37 % and 54.54 ± 1.7 % w were achieved when the drug loading and encapsulation rates were carried out using the stirring method, and the maximum values of 13.75 ± 0.48 % and 68.18 ± 3.33 % were achieved when the drug delivery ratio was 1:5. In the in vitro simulated drug release experiments, the cumulative drug release rate of Cur@DeSC increased with decreasing pH, reaching a maximum of 48.2 ± 2.04 % at pH = 5.5; The haemolysis rate was lower than 5 % and the cell survival rate was higher than 85 %, indicating that DeSC nanoparticles have a good biosafety profile.
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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