热和振动变化对自动体外除颤器电路板的影响:有限元分析研究。

JMIRx med Pub Date : 2025-08-19 DOI:10.2196/53208
Saidi Olayinka Olalere
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引用次数: 0

摘要

背景:自动体外除颤器(AED)是一种在心脏骤停时通过电击恢复心律来防止猝死的装置。目的:分析AED医疗设备在患者反应引起的冲击、移动救护车和空中救护车的振动以及电路板上电池组件引起的热变化时所经历的振动和热变化。方法:AED基本上由塑料制成,外部部分包括显示器、按钮、插座和扬声器,内部部分包括电路板,包括电阻、电容、电感和集成电路等元件。在本研究中,使用Ansys Workbench 2020对AED进行建模,并基于静、动载荷进行校准,验证静态位移,并确定基于无预应力条件获得的第一组5个频率。结果:采用修改后的预应力分析,得到下一组频率,各频率之间的误差为0.0003%。利用该模型对刚性板进行了振动检测和动力分析。同样,以电池为热源对建模电路板进行热分析。评估了电路板周围的散热速率及其对电路元件的影响。结论:在模型电路板中加入更多的支撑结构以减轻变形效应。变形量在33.172 mm处最大,板边变形量最小。高度较高的元件,如电容器,变形更明显。因此,建议在未来的设计中采用较低高度的扁平电容器。此外,电池的大量散热表明需要更好的散热途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Effect of Thermal and Vibration Changes on Automated External Defibrillator Circuit Boards: Finite Element Analysis Study.

Effect of Thermal and Vibration Changes on Automated External Defibrillator Circuit Boards: Finite Element Analysis Study.

Effect of Thermal and Vibration Changes on Automated External Defibrillator Circuit Boards: Finite Element Analysis Study.

Effect of Thermal and Vibration Changes on Automated External Defibrillator Circuit Boards: Finite Element Analysis Study.

Background: An automated external defibrillator (AED) is a device that is used to prevent sudden death by delivering an electrical shock to restore the heart rhythm when experiencing cardiac arrest.

Objective: This study was performed to analyze the vibration and thermal changes experienced by an AED medical device when exposed to shocks caused by patients' reactions, vibrations from mobile and air ambulances, and heat changes due to the battery component on the circuit board.

Methods: Basically, AED is made from plastic, with the external parts containing the display, buttons, pad socket, and speaker, while the internal part entails the circuit boards comprising components such as resistors, capacitors, inductors, and integrated circuits, among others. In this study, the AED was modeled with the Ansys Workbench 2020 and calibrated based on static and dynamic loading to verify the static displacement and determine the first set of five frequencies obtained based on the unprestressed conditions.

Results: Using the prestressed analysis with modifications, the next set of frequencies was obtained with an error margin of 0.0003% between each frequency. The modeled circuit board was used to examine the vibration and dynamic analysis for the rigid board. Similarly, thermal analysis was conducted on the modeled circuit board with the battery serving as the heat source. The rate of dissipation of heat around the board and its effect on the circuit components was evaluated.

Conclusions: The modeled circuit board was reinforced with more support structures to mitigate the deformation effect. The deformation peaked at 33.172 mm, with minimum deformation at the edges of the board. Components with greater height, such as capacitors, experienced more pronounced deformation. Therefore, it is suggested that flat capacitors of lesser height would be suitable for future designs. Additionally, significant heat dissipation from the battery suggests a need for better dissipation pathways.

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