冷烧结介导纳米工程增强CuAgSe/Cu2Se复合材料热电性能

IF 5.6 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Shilong Wu , Qi Ding , Jihu Chen, Zhi Cheng, Xu Wang, Mingming Si, Yuchi Fan, Wan Jiang
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引用次数: 0

摘要

Cu2Se基热电材料在高温下具有显著的热电性能,但中低温性能较差,加工过程耗能大,阻碍了其工业化应用。本研究以维生素C为暂态液体,采用冷烧结工艺制备了CuAgSe/Cu2Se复合材料,不仅将烧结温度降低到350℃,而且与火花等离子烧结制备的材料相比,热电性能优越。保留的CuAgSe纳米片极大地抑制了复合材料的导热性,同时由于界面处的异质结而通过能量屏蔽效应提高了塞贝克系数。此外,CSP引起的位错和内部应变也有效地散射了声子输运,从而在700 K时获得了约1.5的ZT值,在400 ~ 700 K时获得了0.94的高平均ZT值,这表明CSP在热电复合材料中的应用潜力巨大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Enhanced thermoelectric performance in CuAgSe/Cu2Se composite by cold sintering mediated nanoengineering

Enhanced thermoelectric performance in CuAgSe/Cu2Se composite by cold sintering mediated nanoengineering
Cu2Se based thermoelectric materials have remarkable thermoelectric properties especially at high temperature, but the inferior low/medium temperature performance and energy consuming processing prevent the industrial application. In this study, CuAgSe/Cu2Se composites were prepared by cold sintering process using vitamin C as transient liquid, which not only reduces the sintering temperature to 350 °C, but also achieve superior thermoelectric performance compared with the material prepared by spark plasma sintering. The preserved CuAgSe nanoplates greatly suppress the thermal conductivity of composite, while improves the Seebeck coefficient via energy screening effect due to the heterojunctions at interfaces. In addition, the CSP induced dislocations and internal strains also effectively scatter the phonon transport, As a result, a ZT value of about 1.5 at 700 K and a high average ZT value of 0.94 from 400 K to 700 K are obtained, which demonstrates the great potential of CSP for applications in thermoelectric composites.
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来源期刊
Scripta Materialia
Scripta Materialia 工程技术-材料科学:综合
CiteScore
11.40
自引率
5.00%
发文量
581
审稿时长
34 days
期刊介绍: Scripta Materialia is a LETTERS journal of Acta Materialia, providing a forum for the rapid publication of short communications on the relationship between the structure and the properties of inorganic materials. The emphasis is on originality rather than incremental research. Short reports on the development of materials with novel or substantially improved properties are also welcomed. Emphasis is on either the functional or mechanical behavior of metals, ceramics and semiconductors at all length scales.
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