A. Verma , K. Bhatt , J.D. Tanwar , J.S. Tawale , P. Kushwaha , P.K. Siwach , H.K. Singh
{"title":"射频磁控溅射Mn-Ni-Sn Heusler合金薄膜铁磁性和金属丰度的演变","authors":"A. Verma , K. Bhatt , J.D. Tanwar , J.S. Tawale , P. Kushwaha , P.K. Siwach , H.K. Singh","doi":"10.1016/j.rsurfi.2025.100616","DOIUrl":null,"url":null,"abstract":"<div><div>This study investigates the evolution of ferromagnetism and metallicity of Mn–Ni–Sn-based Heusler alloy thin films, approximately 40 nm thick. These films were synthesized via UHV RF magnetron sputtering using a Mn<sub>2</sub>Ni<sub>1.6</sub>Sn<sub>0.4</sub> target on (001)-oriented SrTiO<sub>3</sub> substrates. The deposition temperatures were set at 500 °C, 600 °C, 700 °C, and 800 °C, followed by a 6-h annealing process at the corresponding temperatures. At growth temperatures up to 700 °C, the films displayed B2 or L2<sub>1</sub>-type structures or a combination thereof. However, at 800 °C, the Heusler phase decomposed, resulting in the formation of impurity phases such as Ni<sub>3</sub>Sn or Mn<sub>3</sub>Sn. The surface morphology changed from continuous to discontinuous with increasing growth temperature. All films exhibited Curie temperatures above room temperature. As the growth temperature increased from 500 °C to 700 °C, spontaneous magnetization increased substantially, and the bifurcation between zero-field-cooled (ZFC) and field-cooled warming (FCW) curves decreased. Films deposited at 500 °C, 600 °C, and 700 °C adhered to Bloch's law below 143 K (T ≪ T<sub>C</sub>), while those deposited at 800 °C showed deviation from this. The increase in the residual resistivity ratio (RRR) values from 1.17 for the film grown at 500 °C to 1.64 for films grown at 700 °C, respectively, underscores the evolution of the metallic behavior. The phase-decomposed film showed an exceptionally high RRR = 956.59.</div></div>","PeriodicalId":21085,"journal":{"name":"Results in Surfaces and Interfaces","volume":"20 ","pages":"Article 100616"},"PeriodicalIF":0.0000,"publicationDate":"2025-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Evolution of ferromagnetism and metallicity in RF magnetron sputtered Mn–Ni–Sn Heusler alloy thin films\",\"authors\":\"A. Verma , K. Bhatt , J.D. Tanwar , J.S. Tawale , P. Kushwaha , P.K. Siwach , H.K. Singh\",\"doi\":\"10.1016/j.rsurfi.2025.100616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study investigates the evolution of ferromagnetism and metallicity of Mn–Ni–Sn-based Heusler alloy thin films, approximately 40 nm thick. These films were synthesized via UHV RF magnetron sputtering using a Mn<sub>2</sub>Ni<sub>1.6</sub>Sn<sub>0.4</sub> target on (001)-oriented SrTiO<sub>3</sub> substrates. The deposition temperatures were set at 500 °C, 600 °C, 700 °C, and 800 °C, followed by a 6-h annealing process at the corresponding temperatures. At growth temperatures up to 700 °C, the films displayed B2 or L2<sub>1</sub>-type structures or a combination thereof. However, at 800 °C, the Heusler phase decomposed, resulting in the formation of impurity phases such as Ni<sub>3</sub>Sn or Mn<sub>3</sub>Sn. The surface morphology changed from continuous to discontinuous with increasing growth temperature. All films exhibited Curie temperatures above room temperature. As the growth temperature increased from 500 °C to 700 °C, spontaneous magnetization increased substantially, and the bifurcation between zero-field-cooled (ZFC) and field-cooled warming (FCW) curves decreased. Films deposited at 500 °C, 600 °C, and 700 °C adhered to Bloch's law below 143 K (T ≪ T<sub>C</sub>), while those deposited at 800 °C showed deviation from this. The increase in the residual resistivity ratio (RRR) values from 1.17 for the film grown at 500 °C to 1.64 for films grown at 700 °C, respectively, underscores the evolution of the metallic behavior. 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引用次数: 0
摘要
本文研究了约40 nm厚的mn - ni - sn基Heusler合金薄膜的铁磁性和金属丰度的演变。这些薄膜是在(001)取向SrTiO3衬底上以Mn2Ni1.6Sn0.4为靶材,通过特高压射频磁控溅射制备的。沉积温度分别为500℃、600℃、700℃和800℃,在相应温度下进行6 h的退火处理。在生长温度高达700°C时,薄膜显示B2或l21型结构或其组合。然而,在800℃时,Heusler相分解,形成Ni3Sn或Mn3Sn等杂质相。随着生长温度的升高,表面形貌由连续向不连续转变。所有薄膜的居里温度均高于室温。随着生长温度从500℃升高到700℃,自发磁化强度显著增加,零场冷却(ZFC)和场冷却升温(FCW)曲线的分岔减小。在500°C、600°C和700°C下沉积的薄膜在143 K (T≪TC)以下符合布洛赫定律,而在800°C下沉积的薄膜则与此不同。残余电阻率(RRR)值分别从500℃生长时的1.17增加到700℃生长时的1.64,这表明了金属行为的演变。相分解膜表现出异常高的RRR = 956.59。
Evolution of ferromagnetism and metallicity in RF magnetron sputtered Mn–Ni–Sn Heusler alloy thin films
This study investigates the evolution of ferromagnetism and metallicity of Mn–Ni–Sn-based Heusler alloy thin films, approximately 40 nm thick. These films were synthesized via UHV RF magnetron sputtering using a Mn2Ni1.6Sn0.4 target on (001)-oriented SrTiO3 substrates. The deposition temperatures were set at 500 °C, 600 °C, 700 °C, and 800 °C, followed by a 6-h annealing process at the corresponding temperatures. At growth temperatures up to 700 °C, the films displayed B2 or L21-type structures or a combination thereof. However, at 800 °C, the Heusler phase decomposed, resulting in the formation of impurity phases such as Ni3Sn or Mn3Sn. The surface morphology changed from continuous to discontinuous with increasing growth temperature. All films exhibited Curie temperatures above room temperature. As the growth temperature increased from 500 °C to 700 °C, spontaneous magnetization increased substantially, and the bifurcation between zero-field-cooled (ZFC) and field-cooled warming (FCW) curves decreased. Films deposited at 500 °C, 600 °C, and 700 °C adhered to Bloch's law below 143 K (T ≪ TC), while those deposited at 800 °C showed deviation from this. The increase in the residual resistivity ratio (RRR) values from 1.17 for the film grown at 500 °C to 1.64 for films grown at 700 °C, respectively, underscores the evolution of the metallic behavior. The phase-decomposed film showed an exceptionally high RRR = 956.59.