三星智能手机芯片移植法鉴定

IF 2.2 4区 医学 Q3 COMPUTER SCIENCE, INFORMATION SYSTEMS
Sunbum Song , Hongseok Yang , Eunji Lee , Sangeun Lee , Gibum Kim
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引用次数: 0

摘要

随着移动取证技术的进步,破坏智能手机等反取证活动增加,同时也促使各大厂商加强数据加密政策。这些变化导致法医分析人员在从损坏的智能手机中提取数据时必须进行“芯片移植”。Chip-transplantation是指将数据存储和解密模块从原损坏设备移植到同型号兼容设备上的方法。然而,芯片移植包括诸如芯片脱落之类的过程,这在数据完整性方面是有风险的,并且需要全面了解目标设备的硬件才能成功恢复。本研究旨在探索与三星电子高级智能手机的AP和eSE模块兼容的芯片移植技术的改进。实验结果表明,为了在三星智能手机上成功地通过芯片移植获取数据,无论用户密码设置如何,都需要将eSE模块与AP和闪存一起移植。由于缺乏对eSE的物理结构和PCB放置的研究,本研究提供了eSE的终端信息、PCB放置和跳点,以绕过PCB引脚端子的损坏。最后,对于在移植之前或之后怀疑AP或eSE模块损坏的情况,本研究建议采用两种侵入性较小且成本效益较好的诊断方法——启动过程中的智能手机日志分析和电流消耗模式分析——可与传统的连续性测试、热成像和x射线分析一起使用。随着智能手机中专用加密模块的采用与隐私保护方案的增长,本研究将有助于提高芯片移植成功率,以应对不断发展的硬件环境。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Forensic recovery via chip-transplantation in samsung smartphones
The advancement of mobile forensic technology has induced the increase of anti-forensic activities such as smartphone destruction, while prompting major manufacturers to strengthen their data encryption policies at the same time. Such changes resulted in forensic analysts having to perform ‘Chip-transplantation’ when extracting data from damaged smartphones. Chip-transplantation is a method referring to transplanting data storage and decryption modules from the original damaged device to a compatible device of same model. However, chip-transplantation consists of procedures such as chip-off which are risky in terms of data integrity, and require comprehensive understanding of the target device's hardware for a successful recovery. This study explores the improvements to chip-transplantation techniques that are compatible with Samsung's premium smartphone's AP and eSE modules. Experimental results indicate that for a successful data acquisition via Chip-Transplantation on Samsung smartphones, transplantation of the eSE module along with the AP and flash memory is required irrespective of user password settings. As there is a lack of research on the physical structure and PCB placement of the eSE, this study provides eSE's terminal information, PCB placement, and jump points to bypass damage to PCB pin terminals. Lastly, for cases where damage to AP or eSE modules is suspected prior to or after transplantation, this study suggests two less invasive and cost-effective diagnostic methods – smartphone log analysis during the boot process and current consumption pattern analysis – that can be used along with conventional continuity testing, thermal imaging, and X-ray analysis. As the adoption of dedicated encryption modules in smartphones grows with privacy protection schemes, this study will contribute to advancing the chip-transplantation success rate against ever-evolving hardware landscape.
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来源期刊
CiteScore
5.90
自引率
15.00%
发文量
87
审稿时长
76 days
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