可控螺旋磁流变精加工(CSMRF)中表面粗糙度的形成机理及超光滑表面的实现

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Bo Wang , Ci Song , Feng Shi , Wanli Zhang , Xing Peng , Guipeng Tie , Shuo Qiao
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引用次数: 0

摘要

现有的磁流变精加工技术由于磨料颗粒的定向刮擦而在工件表面产生定向织构粗糙度误差。因此,我们提出了一种新的可控螺旋磁流变表面粗糙度平滑方法(CSMRF)。从理论上分析了单粒磨粒在磁流变场中的材料去除特性和表面粗糙度的形成机理。结合CSMRF的特性,建立了表面粗糙度模型。随着螺旋角的增大,表面纹理逐渐被破坏,表面粗糙度得到有效提高。结果表明,当螺旋角为20°时,表面粗糙度降至0.251 nm。PSD曲线说明了螺旋角平滑更高频段的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The formation mechanism of surface roughness and the realization of ultra-smooth surface in controllable spiral magnetorheological finishing (CSMRF)
Existing magnetorheological finishing (MRF) introduces a directional texture roughness error on the workpiece surface due to the directional scratching of abrasive particles. Therefore, we propose a new controllable spiral magnetorheological finishing (CSMRF) method for surface roughness smoothing. We theoretically analyzed the material removal characteristics of single abrasive particles and the formation mechanism of surface roughness in MRF. We established a model of surface roughness by combining it with the characteristics of CSMRF. As the spiral angle increases, the surface texture is gradually disrupted, and the surface roughness is effectively improved. Findings indicate that the surface roughness is reduced to 0.251 nm at a spiral angle of 20°. The PSD curve illustrates the ability of the spiral angle to smooth higher frequency bands.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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