激光粉末床熔合工艺参数制备无支撑的超材料晶格悬垂结构

IF 3.2 3区工程技术 Q2 ENGINEERING, INDUSTRIAL

Cirp Annals-Manufacturing Technology Pub Date : 2025-01-01 DOI:10.1016/j.cirp.2025.03.003

Wessel W. Wits (2) , Camill de Vos , Maria Montero-Sistiaga , Marc de Smit

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引用次数: 0

摘要

激光粉末床熔接超材料晶格所需的无支撑悬垂结构是一种难以制造的材料。在这项研究中，实验确定了工艺参数，以成功地制造auxetic重入超材料结构。由于无支撑打印，与轮廓和舱口扫描相比，需要更高的线性能量密度来构建连续固化的悬垂结构。模拟结果表明，熔池宽度，特别是长度被扩大，通过剥蚀和成球促进松散粉末的附着。成功制备了一种辅助可重入超材料。与以往的研究相比，冲击试验表明其具有良好的力学性能和更好的能量吸收。

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Laser powder bed fusion process parameters for the fabrication of unsupported overhang structures of metamaterial lattices

Laser powder bed fusion of unsupported overhang structures, required for metamaterial lattices, are difficult to manufacture. In this study, process parameters are experimentally determined to successfully fabricate auxetic re-entrant metamaterial structures. Due to the support-less printing, higher linear energy densities compared to contour and hatch scanning are required to build continuously solidified overhang structures. Simulation results show that the melt pool width and in particular the length is enlarged, promoting loose powder attachment by denudation and balling. Auxetic re-entrant metamaterials are successfully fabricated. Impact tests show good mechanical performance and better energy absorption compared to previous studies.

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来源期刊

Cirp Annals-Manufacturing Technology 工程技术-工程：工业

CiteScore

7.50

自引率

9.80%

发文量

137

审稿时长

13.5 months

期刊介绍： CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.