超短脉冲激光加工金刚石中去除改性的高效加工

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL
Reina Yoshizaki , Shogo Kitamura , Yuta Teshima , Masayuki Nakao (1)
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引用次数: 0

摘要

随着金刚石工业应用的不断扩大,人们对超短脉冲激光加工金刚石的精度和效率提出了更高的要求。然而,激光辐照过程中产生的表面改性层对加工效率产生负面影响,并且难以主动控制。本研究提出并验证了在每次脉冲后去除表面修饰层的两步法,从而提高了加工效率。去除修饰层增加了材料的去除率,并为修饰层对加工结果的影响提供了新的见解,为未来超短脉冲激光加工钻石奠定了基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Efficient processing with removal of modification in ultrashort pulse laser processing of diamond
The demand for higher precision and efficiency in the ultrashort pulse laser processing of diamonds is growing as the industrial applications of diamonds expand. However, surface modification layers generated during laser irradiation negatively impact processing efficiency and remain difficult to actively control. This study improves processing efficiency by proposing and validating a two-step method that removes the surface modification layer after each pulse. Removing the modified layer increases the material removal volume and provides new insights into the impact of the modified layer on processing outcomes, laying the groundwork for future advancements in the ultrashort pulse laser processing of diamonds.
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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