面向非晶粒取向电工钢改进型磁导结构的大规模生产

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL
Phillip Stöcks-Morgan , Tobias Neuwirth , Achref Douiri , Simon R. Sebold , Anders Kaestner , Christoph Hartmann , Nora Leuning , Michael Schulz , Wolfram Volk (1)
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引用次数: 0

摘要

现代同步电力驱动要求转子的磁各向异性,由无取向电工钢制造。传统上,通过去除材料,在电钢板上放置磁通屏障,形成小凹槽。虽然这种方法在磁力上是有效的,但转子的机械性能却被削弱了。压花磁通屏障提供了一种方法,使转子机械硬化,提高效率。所需的微压花首次在工业级印刷机上成功生产。使用中子光栅干涉测量和单片测试仪对样品进行磁性表征表明,该新技术可从实验室框架转移到大规模工业制造过程中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Towards large-scale production of improved magnetic flux guidance structures in non-grain-oriented electrical steel
Modern synchronous electric drives require magnetic anisotropy in their rotor, manufactured from non-oriented electrical steel. Conventionally, flux barriers are placed on electrical steel sheets by removing the material, creating small recesses. While the approach is magnetically effective, the rotor is mechanically weakened. Embossed flux barriers offer an approach to stiffen the rotor mechanically, increasing efficiency. The required micro-embossing was successfully produced on an industry-grade press for the first time. Magnetic characterisation of the samples using neutron grating interferometry and a single sheet tester shows that the novel technology is transferrable from the laboratory frame to large-scale industrial manufacturing processes.
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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