{"title":"氢等离子体等离子体辅助抛光中氮化镓(0001)的高效修饰机理","authors":"Tong Tao, Rongyan Sun, Yuji Ohkubo, Kazuya Yamamura (2)","doi":"10.1016/j.cirp.2025.03.045","DOIUrl":null,"url":null,"abstract":"<div><div>Gallium nitride (GaN) is a promising material for high-power, high-frequency electronic devices. Plasma-assisted polishing (PAP) process achieved high-quality surface polishing of GaN by combining plasma modification with the removal of modified layer using soft abrasives. In PAP, the modification rate directly determines the overall PAP efficiency. This study replaced traditional oxidative plasma with vacuum H₂ plasma, which has a smaller atomic diameter and reducing properties, to improve modification efficiency. By thoroughly investigating the mechanism of H₂ plasma modification on GaN surface and optimizing the relevant process parameters, efficient and controllable GaN surface modification was achieved while suppressing surface roughness deterioration.</div></div>","PeriodicalId":55256,"journal":{"name":"Cirp Annals-Manufacturing Technology","volume":"74 1","pages":"Pages 447-451"},"PeriodicalIF":3.2000,"publicationDate":"2025-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High-efficiency modification mechanism of GaN(0001) in plasma-assisted polishing using hydrogen plasma\",\"authors\":\"Tong Tao, Rongyan Sun, Yuji Ohkubo, Kazuya Yamamura (2)\",\"doi\":\"10.1016/j.cirp.2025.03.045\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Gallium nitride (GaN) is a promising material for high-power, high-frequency electronic devices. Plasma-assisted polishing (PAP) process achieved high-quality surface polishing of GaN by combining plasma modification with the removal of modified layer using soft abrasives. In PAP, the modification rate directly determines the overall PAP efficiency. This study replaced traditional oxidative plasma with vacuum H₂ plasma, which has a smaller atomic diameter and reducing properties, to improve modification efficiency. By thoroughly investigating the mechanism of H₂ plasma modification on GaN surface and optimizing the relevant process parameters, efficient and controllable GaN surface modification was achieved while suppressing surface roughness deterioration.</div></div>\",\"PeriodicalId\":55256,\"journal\":{\"name\":\"Cirp Annals-Manufacturing Technology\",\"volume\":\"74 1\",\"pages\":\"Pages 447-451\"},\"PeriodicalIF\":3.2000,\"publicationDate\":\"2025-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Cirp Annals-Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0007850625000447\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, INDUSTRIAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Cirp Annals-Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0007850625000447","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, INDUSTRIAL","Score":null,"Total":0}
High-efficiency modification mechanism of GaN(0001) in plasma-assisted polishing using hydrogen plasma
Gallium nitride (GaN) is a promising material for high-power, high-frequency electronic devices. Plasma-assisted polishing (PAP) process achieved high-quality surface polishing of GaN by combining plasma modification with the removal of modified layer using soft abrasives. In PAP, the modification rate directly determines the overall PAP efficiency. This study replaced traditional oxidative plasma with vacuum H₂ plasma, which has a smaller atomic diameter and reducing properties, to improve modification efficiency. By thoroughly investigating the mechanism of H₂ plasma modification on GaN surface and optimizing the relevant process parameters, efficient and controllable GaN surface modification was achieved while suppressing surface roughness deterioration.
期刊介绍:
CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems.
This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include:
Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.