Superb thermal stability and strength in Al/Ti/V-modified Ni-based high-entropy alloy via asymmetric cryo-rolling tailored hierarchical microstructures

To meet stringent demands of harsh environment in high-temperature semiconductor manufacturing, advanced Ni-based alloys with superior strength and thermal stability is imperative. This study presents a novel Ni₃₅(CrFe)₃₈Co₁₃(TiV)₈Al₆ (at. %) high-entropy alloy to strengthen the matrix and enhance thermal stability via precipitate pinning, micro-alloyed with Al, Ti, and V and processed by an asymmetric cryo-rolling pathway. During processing, dynamic recovery is suppressed, leading remarkable grain refinement and achieving an ultrahigh yield strength (> 1.2 GPa). High-temperature thermal exposure tests (650–950 °C for 6 h) demonstrate remarkable resistance to microstructural coarsening and phase decomposition, attributed to second-phase nanoparticles, refined grains, and abundant low-angle grain boundaries. The synergistic combination of compositional optimization and processing innovations overcomes conventional trade-off between ambient strength and thermal stability, demonstrating its potential as a robust structural material for critical components in semiconductor equipment. This work provides a groundbreaking strategy for developing next-generation high-temperature alloys through hierarchical microstructure engineering.