Laser-shock-induced flattening of silver nanowires for preparing high-performance composite transparent electrodes with enhanced durability

Flexible transparent electrodes demand seamless integration of conductive nanomaterials with protective layers. However, the geometric incompatibility between three-dimensional (3D) silver nanowire (AgNW) networks and atomically flat two-dimensional (2D) materials remains a fundamental bottleneck, leading to interfacial stress fractures and rapid corrosion. Here, we present a laser shock-driven planarization strategy that actively reconfigures 3D AgNW networks into quasi-2D architectures, addressing interfacial mismatch by simultaneous suppression of surface roughness and stress concentration. By synergizing the mechanical compaction effect of laser shock and the localized plasmon-enhanced heating effect, the method establishes robust metallurgical junction at junction interfaces, reducing the average welded junction height to 53.2 % of its original value while enabling fracture-free and full-coverage integration with graphene oxide (GO). The resulting AgNWs-GO composite exhibits exceptional durability, retaining 97.9 % conductivity after 2000-second exposure in sulfur vapor. By resolving dimensional incompatibility through active structural engineering, this work provides a universal pathway for heterodimensional material integration in robust flexible electronics for wearable, display, and energy applications.