{"title":"ESRPCB:一种边缘引导的超分辨率模型和集成学习用于微小印刷电路板缺陷检测","authors":"Xiem HoangVan , Dang Bui Dinh , Thanh Nguyen Canh , Van-Truong Nguyen","doi":"10.1016/j.engappai.2025.111547","DOIUrl":null,"url":null,"abstract":"<div><div>Printed Circuit Boards (PCBs) are critical components in modern electronics, which require stringent quality control to ensure proper functionality. However, the detection of defects in small-scale PCBs images poses significant challenges as a result of the low resolution of the captured images, leading to potential confusion between defects and noise. To overcome these challenges, this paper proposes a novel framework, named ESRPCB (edge-guided super-resolution for PCBs defect detection), which combines edge-guided super-resolution with ensemble learning to enhance PCBs defect detection. The framework leverages the edge information to guide the EDSR (Enhanced Deep Super-Resolution) model with a novel ResCat (Residual Concatenation) structure, enabling it to reconstruct high-resolution images from small PCBs inputs. By incorporating edge features, the super-resolution process preserves critical structural details, ensuring that tiny defects remain distinguishable in the enhanced image. Following this, a multi-modal defect detection model employs ensemble learning to analyze the super-resolved image, improving the accuracy of defect identification. Experimental results demonstrate that ESRPCB achieves superior performance compared to State-of-the-Art (SOTA) methods, achieving an average Peak Signal to Noise Ratio (PSNR) of 30.54 <span><math><mrow><mi>d</mi><mi>B</mi><mrow><mo>(</mo><mi>d</mi><mi>e</mi><mi>c</mi><mi>i</mi><mi>b</mi><mi>e</mi><mi>l</mi><mo>)</mo></mrow></mrow></math></span>, surpassing EDSR by <span><math><mrow><mn>0</mn><mo>.</mo><mn>42</mn><mi>d</mi><mi>B</mi></mrow></math></span>. In defect detection, ESRPCB achieves a mAP50(mean average precision at an Intersection over Union threshold of 0.50) of 0.965, surpassing EDSR (0.905) and traditional super-resolution models by over 5%. Furthermore, the ensemble-based detection approach further enhances performance, achieving a mAP50 of 0.977. These results highlight the effectiveness of ESRPCB in enhancing both image quality and defect detection accuracy, particularly in challenging low-resolution scenarios.</div></div>","PeriodicalId":50523,"journal":{"name":"Engineering Applications of Artificial Intelligence","volume":"159 ","pages":"Article 111547"},"PeriodicalIF":8.0000,"publicationDate":"2025-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"ESRPCB: An edge guided super-Resolution model and ensemble learning for tiny Printed Circuit Board defect detection\",\"authors\":\"Xiem HoangVan , Dang Bui Dinh , Thanh Nguyen Canh , Van-Truong Nguyen\",\"doi\":\"10.1016/j.engappai.2025.111547\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Printed Circuit Boards (PCBs) are critical components in modern electronics, which require stringent quality control to ensure proper functionality. However, the detection of defects in small-scale PCBs images poses significant challenges as a result of the low resolution of the captured images, leading to potential confusion between defects and noise. To overcome these challenges, this paper proposes a novel framework, named ESRPCB (edge-guided super-resolution for PCBs defect detection), which combines edge-guided super-resolution with ensemble learning to enhance PCBs defect detection. The framework leverages the edge information to guide the EDSR (Enhanced Deep Super-Resolution) model with a novel ResCat (Residual Concatenation) structure, enabling it to reconstruct high-resolution images from small PCBs inputs. By incorporating edge features, the super-resolution process preserves critical structural details, ensuring that tiny defects remain distinguishable in the enhanced image. Following this, a multi-modal defect detection model employs ensemble learning to analyze the super-resolved image, improving the accuracy of defect identification. Experimental results demonstrate that ESRPCB achieves superior performance compared to State-of-the-Art (SOTA) methods, achieving an average Peak Signal to Noise Ratio (PSNR) of 30.54 <span><math><mrow><mi>d</mi><mi>B</mi><mrow><mo>(</mo><mi>d</mi><mi>e</mi><mi>c</mi><mi>i</mi><mi>b</mi><mi>e</mi><mi>l</mi><mo>)</mo></mrow></mrow></math></span>, surpassing EDSR by <span><math><mrow><mn>0</mn><mo>.</mo><mn>42</mn><mi>d</mi><mi>B</mi></mrow></math></span>. In defect detection, ESRPCB achieves a mAP50(mean average precision at an Intersection over Union threshold of 0.50) of 0.965, surpassing EDSR (0.905) and traditional super-resolution models by over 5%. Furthermore, the ensemble-based detection approach further enhances performance, achieving a mAP50 of 0.977. These results highlight the effectiveness of ESRPCB in enhancing both image quality and defect detection accuracy, particularly in challenging low-resolution scenarios.</div></div>\",\"PeriodicalId\":50523,\"journal\":{\"name\":\"Engineering Applications of Artificial Intelligence\",\"volume\":\"159 \",\"pages\":\"Article 111547\"},\"PeriodicalIF\":8.0000,\"publicationDate\":\"2025-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Engineering Applications of Artificial Intelligence\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0952197625015490\",\"RegionNum\":2,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"AUTOMATION & CONTROL SYSTEMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering Applications of Artificial Intelligence","FirstCategoryId":"94","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0952197625015490","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
ESRPCB: An edge guided super-Resolution model and ensemble learning for tiny Printed Circuit Board defect detection
Printed Circuit Boards (PCBs) are critical components in modern electronics, which require stringent quality control to ensure proper functionality. However, the detection of defects in small-scale PCBs images poses significant challenges as a result of the low resolution of the captured images, leading to potential confusion between defects and noise. To overcome these challenges, this paper proposes a novel framework, named ESRPCB (edge-guided super-resolution for PCBs defect detection), which combines edge-guided super-resolution with ensemble learning to enhance PCBs defect detection. The framework leverages the edge information to guide the EDSR (Enhanced Deep Super-Resolution) model with a novel ResCat (Residual Concatenation) structure, enabling it to reconstruct high-resolution images from small PCBs inputs. By incorporating edge features, the super-resolution process preserves critical structural details, ensuring that tiny defects remain distinguishable in the enhanced image. Following this, a multi-modal defect detection model employs ensemble learning to analyze the super-resolved image, improving the accuracy of defect identification. Experimental results demonstrate that ESRPCB achieves superior performance compared to State-of-the-Art (SOTA) methods, achieving an average Peak Signal to Noise Ratio (PSNR) of 30.54 , surpassing EDSR by . In defect detection, ESRPCB achieves a mAP50(mean average precision at an Intersection over Union threshold of 0.50) of 0.965, surpassing EDSR (0.905) and traditional super-resolution models by over 5%. Furthermore, the ensemble-based detection approach further enhances performance, achieving a mAP50 of 0.977. These results highlight the effectiveness of ESRPCB in enhancing both image quality and defect detection accuracy, particularly in challenging low-resolution scenarios.
期刊介绍:
Artificial Intelligence (AI) is pivotal in driving the fourth industrial revolution, witnessing remarkable advancements across various machine learning methodologies. AI techniques have become indispensable tools for practicing engineers, enabling them to tackle previously insurmountable challenges. Engineering Applications of Artificial Intelligence serves as a global platform for the swift dissemination of research elucidating the practical application of AI methods across all engineering disciplines. Submitted papers are expected to present novel aspects of AI utilized in real-world engineering applications, validated using publicly available datasets to ensure the replicability of research outcomes. Join us in exploring the transformative potential of AI in engineering.