心脏植入式电子装置的导联穿孔:发生率、诊断和处理。

IF 1.3
Olayiwola A Bolaji, Favour E Markson, Kevin F Kwaku, Robert D Schaller
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引用次数: 0

摘要

由于人口老龄化、诊断技术的进步和技术的改进,心脏植入式电子装置(CIEDs)的植入稳步增加。然而,铅植入后心脏穿孔的风险虽然很低,但仍然是一个关键问题。了解这种并发症的临床表现对有效预防、识别和管理至关重要。本文综述了CIED导联引起的心脏穿孔的患病率、临床表现、危险因素、诊断、治疗策略和未来展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lead Perforation in Cardiac Implantable Electronic Devices: Incidence, Diagnosis, and Management.

The implantation of cardiac implantable electronic devices (CIEDs) has steadily increased due to an aging population, advancements in diagnostic techniques, and technological improvements. However, the risk of cardiac perforation following lead implantation, though low, remains a critical concern. Understanding the clinical presentations of this complication is essential for effective prevention, recognition, and management. This review explores the prevalence, clinical presentations, risk factors, diagnosis, management strategies, and future perspectives related to cardiac perforation caused by CIED leads.

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