金属/陶瓷(Cu/MgB2)超导体线的一种新型粉中粉制造方法:生产和工艺表征

IF 6.8 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Fehmi Nair , Hafız Muhammad Numan Zafar , Emre Ciminli
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引用次数: 0

摘要

Cu-MgB2线被广泛应用于高科技设备:核磁共振成像仪的高磁场线圈、粒子加速器、聚变反应堆和磁悬浮系统。MgB2是一种经济高效的超导体,具有较高的临界温度(39k),而Cu具有优异的可成形性、强度和可绕性。由于这些特性,超导体是使用管内粉末(PIT)方法生产的:将金属/陶瓷粉末插入基体管中,并通过轧制/拉伸成形导线。然而,PIT存在粉末与护套不兼容、界面处存在二次相、材料选择范围窄等缺点。本研究通过优化挤压参数和利用挤压过程中死金属区(DMZ)的形成,探索并表征了粉末中粉末(PIP)的替代方法。结果表明,优化挤压参数(450℃、85 MPa、模具角度/挤压比45°/4)和在挤压模后引入Cu缓冲器(45%)有助于在DMZ和Cu粉界面处产生高摩擦。摩擦作用导致粉末和非粉末形式的铜保险杠在剪切区夹杂。在PIT法中,保险杠被均匀地消耗成类似于管的超导体导线护套。详细的微观结构表征表明,新型PIP方法生产的无裂纹、可缠绕的金属丝具有超导性和与PIT方法制造的金属丝相当的结构性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A novel powder-in-powder manufacturing approach for metal/ceramic (Cu/MgB2) superconductor wires: production and process characterization
Cu-MgB2 wires are actively used in high technology equipment: coils of high magnetic fields in MRI machines, particle accelerators, fusion reactors, and magnetic levitation (maglev) systems. MgB2 is a cost-effective superconductor with a high critical temperature (39 K) and Cu provides excellent formability, strength, and windability. Due to these properties, superconductors are produced using powder-in-tube (PIT) method: inserting metal/ceramic powders into a matrix tube and forming wires through rolling/drawing. However, PIT has shortcomings such as powder-sheath incompatibilities, secondary phases at the interfaces and a narrow material selection scope. This study explores and characterizes an alternative powder-in-powder (PIP) approach by optimizing extrusion parameters and leveraging the formation of dead metal zone (DMZ) during extrusion. Results showed that optimizing the extrusion parameters (450 °C, 85 MPa, die angle/extrusion ratio: 45°/4) and introducing a Cu bumper (45 %) behind the extrusion die assists inducing high friction at the DMZ and Cu powder interface. The friction causes inclusion of the powder and non-powder form of Cu bumper in the shear zone. The bumper is homogenously consumed to become the sheath of superconductor wires similar to the tube in the PIT method. Detailed microstructural characterization shows that the novel PIP method produces crack-free, windable wires with superconducting and structural properties comparable to those fabricated using the PIT method.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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