Feiyang Ou , Julius Suherman , Chao Zhang , Henrik Wang , Sthitie Bom , James F. Davis , Panagiotis D. Christofides
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Smart Manufacturing applied to front-end wafer manufacturing in the semiconductor industry offers significant opportunity to increase production throughput and ensure precision by increasing staff and operational productivity. Front-end wafer manufacturing involves multi tool operations for complex material processing that requires a high degree of precision and extensive product qualification. There is a high degree of commonality with semiconductor manufacturing tools, for example etching, that are well instrumented. Companies are already collecting large amounts of operational data from these tools that can be aggregated and leveraged for virtual metrology and other control, diagnostic, and management solutions. AI/ML/DS modeling involves monitoring the state of an operation in real-time to continuously learn and improve on human centered, automated, and autonomous actions. This operational data are embedded in invaluable machine, process, product, and material behaviors as interaction complexities, linearities/non-linearities, and dimensional effects. Because of machine commonalities, data can be selected to draw out operational value across machines. Today’s data science offers considerable capability for qualifying, assessing alignment and contribution, aggregating, and engineering data for more robust modeling. We refer to this as a Data-first strategy to process, engineer and model with AI-Ready data. In this paper, we address AI-Ready data for a virtual metrology solution focused on etching measurement PASS/FAIL classification and milling depth prediction regression tasks using operational data from production machine tools. If the quality of the product can be predicted, the productivity of the metrology process can be increased, which in turn increases the productivity of the overall operation. In a previous paper, we considered how to aggregate data from different etch tools in the same processes at different factories within Seagate Technology and proposed a method for data aggregation and demonstrated its value (Ou et al., 2024). The present paper considers how to process and engineer datasets from two different etch tool processes: wafer and slider production. The data processing approaches when used systematically with appropriate ML algorithms demonstrate the potential for reducing metrological interventions in semiconductor manufacturing. Advanced machine learning techniques are used to tackle the modeling challenges of a low failure rate and limited operational variability. XGBoost, a gradient descent-based tree algorithm, outperforms the commonly used Feedforward Neural Networks (FNN) in terms of training speed and resource utilization for binary-classifications, as well the performance criterion in ROC-AUC score (classification), Median Absolute Error (regression) and <span><math><msup><mrow><mi>R</mi></mrow><mrow><mn>2</mn></mrow></msup></math></span> value. Principal Component Analysis (PCA) effectively reduces the dimensionality of the data and overfitting, while retaining vital variances and significantly reducing noise. Data aggregation with separated scaling harmonizes inputs from diverse manufacturing tools and significantly improves the efficacy and versatility of combining multiple datasets to improve model performance. A live updating transfer learning approach, that periodically updates the FNN models in real-time using Stochastic Gradient Descent (SGD) with individual data points, addresses process drift, and markedly improves predictive accuracy. For the slider production tools, data augmentation with linear Mixup, overcomes a short recording period, enriches the training dataset, and significantly reduces error metrics.</div></div>","PeriodicalId":72815,"journal":{"name":"Digital Chemical Engineering","volume":"15 ","pages":"Article 100242"},"PeriodicalIF":3.0000,"publicationDate":"2025-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Industrial multi-machine data aggregation, AI-ready data preparation, and machine learning for virtual metrology in semiconductor wafer and slider production\",\"authors\":\"Feiyang Ou , Julius Suherman , Chao Zhang , Henrik Wang , Sthitie Bom , James F. 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Front-end wafer manufacturing involves multi tool operations for complex material processing that requires a high degree of precision and extensive product qualification. There is a high degree of commonality with semiconductor manufacturing tools, for example etching, that are well instrumented. Companies are already collecting large amounts of operational data from these tools that can be aggregated and leveraged for virtual metrology and other control, diagnostic, and management solutions. AI/ML/DS modeling involves monitoring the state of an operation in real-time to continuously learn and improve on human centered, automated, and autonomous actions. This operational data are embedded in invaluable machine, process, product, and material behaviors as interaction complexities, linearities/non-linearities, and dimensional effects. Because of machine commonalities, data can be selected to draw out operational value across machines. Today’s data science offers considerable capability for qualifying, assessing alignment and contribution, aggregating, and engineering data for more robust modeling. We refer to this as a Data-first strategy to process, engineer and model with AI-Ready data. In this paper, we address AI-Ready data for a virtual metrology solution focused on etching measurement PASS/FAIL classification and milling depth prediction regression tasks using operational data from production machine tools. If the quality of the product can be predicted, the productivity of the metrology process can be increased, which in turn increases the productivity of the overall operation. In a previous paper, we considered how to aggregate data from different etch tools in the same processes at different factories within Seagate Technology and proposed a method for data aggregation and demonstrated its value (Ou et al., 2024). 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引用次数: 0
摘要
智能制造(SM)是“智能(预测性、预防性、前瞻性)零事故、零排放制造”的缩写,它描述了制造业的数字化转型,在这种转型中,工厂、供应链和生态系统是集成的、可互操作的、互联的。智能制造植根于人工智能、机器学习(ML)和数据同步(DS)建模,以挖掘宝贵的运营数据。通过使数据在更大范围内可操作,SM开辟了提高生产率、精度和流程性能的新途径。智能制造应用于半导体行业的前端晶圆制造,通过提高员工和运营生产率,为提高生产吞吐量和确保精度提供了重要机会。前端晶圆制造涉及复杂材料加工的多工具操作,需要高度精度和广泛的产品认证。与半导体制造工具有高度的共性,例如蚀刻,这是良好的仪器。公司已经从这些工具中收集了大量的操作数据,这些数据可以用于虚拟计量和其他控制、诊断和管理解决方案。AI/ML/DS建模涉及实时监控操作状态,以不断学习和改进以人为中心的自动化和自主操作。这些操作数据嵌入在宝贵的机器、过程、产品和材料行为中,如交互复杂性、线性/非线性和维度效应。由于机器的共性,可以选择数据来跨机器提取操作值。今天的数据科学提供了相当大的能力来鉴定、评估对齐和贡献、聚合和工程数据,以实现更健壮的建模。我们将其称为数据优先策略,以处理、设计和建模ai就绪数据。在本文中,我们解决了虚拟计量解决方案的AI-Ready数据,该解决方案专注于蚀刻测量PASS/FAIL分类和铣削深度预测回归任务,使用生产机床的操作数据。如果可以预测产品的质量,则可以提高计量过程的生产率,从而提高整体操作的生产率。在之前的一篇论文中,我们考虑了如何在希捷科技内部不同工厂的相同流程中聚合来自不同蚀刻工具的数据,并提出了一种数据聚合方法并展示了其价值(Ou et al., 2024)。本文考虑了如何处理和设计来自两种不同蚀刻工具过程的数据集:晶圆和滑块生产。当系统地使用适当的ML算法时,数据处理方法显示了减少半导体制造计量干预的潜力。先进的机器学习技术用于解决低故障率和有限操作可变性的建模挑战。XGBoost是一种基于梯度下降的树算法,在二元分类的训练速度和资源利用率方面优于常用的前馈神经网络(FNN),在ROC-AUC分数(分类)、绝对误差中位数(回归)和R2值方面的性能标准也优于前者。主成分分析(PCA)有效地降低了数据的维数和过拟合,同时保留了重要方差并显著降低了噪声。具有分离缩放的数据聚合协调了来自不同制造工具的输入,并显着提高了组合多个数据集的效率和通用性,从而提高了模型性能。一种实时更新迁移学习方法,该方法使用随机梯度下降(SGD)和单个数据点定期实时更新FNN模型,解决了过程漂移,并显着提高了预测精度。对于滑块生产工具,使用线性Mixup进行数据增强,克服了较短的记录周期,丰富了训练数据集,并显着降低了误差指标。
Industrial multi-machine data aggregation, AI-ready data preparation, and machine learning for virtual metrology in semiconductor wafer and slider production
Smart Manufacturing (SM), which is short for “Smart (Predictive, Preventive, Proactive) zero incident, zero emissions Manufacturing,” describes manufacturing’s digital transformation in which factories, supply chains and ecosystems are integrated, interoperable, and interconnected. Smart Manufacturing is rooted in AI, Machine Learned (ML), and Data Synchronized (DS) modeling to tap into invaluable operating data. By making data actionable at larger scales, SM opens new ways to increase productivity, precision, and process performance. Smart Manufacturing applied to front-end wafer manufacturing in the semiconductor industry offers significant opportunity to increase production throughput and ensure precision by increasing staff and operational productivity. Front-end wafer manufacturing involves multi tool operations for complex material processing that requires a high degree of precision and extensive product qualification. There is a high degree of commonality with semiconductor manufacturing tools, for example etching, that are well instrumented. Companies are already collecting large amounts of operational data from these tools that can be aggregated and leveraged for virtual metrology and other control, diagnostic, and management solutions. AI/ML/DS modeling involves monitoring the state of an operation in real-time to continuously learn and improve on human centered, automated, and autonomous actions. This operational data are embedded in invaluable machine, process, product, and material behaviors as interaction complexities, linearities/non-linearities, and dimensional effects. Because of machine commonalities, data can be selected to draw out operational value across machines. Today’s data science offers considerable capability for qualifying, assessing alignment and contribution, aggregating, and engineering data for more robust modeling. We refer to this as a Data-first strategy to process, engineer and model with AI-Ready data. In this paper, we address AI-Ready data for a virtual metrology solution focused on etching measurement PASS/FAIL classification and milling depth prediction regression tasks using operational data from production machine tools. If the quality of the product can be predicted, the productivity of the metrology process can be increased, which in turn increases the productivity of the overall operation. In a previous paper, we considered how to aggregate data from different etch tools in the same processes at different factories within Seagate Technology and proposed a method for data aggregation and demonstrated its value (Ou et al., 2024). The present paper considers how to process and engineer datasets from two different etch tool processes: wafer and slider production. The data processing approaches when used systematically with appropriate ML algorithms demonstrate the potential for reducing metrological interventions in semiconductor manufacturing. Advanced machine learning techniques are used to tackle the modeling challenges of a low failure rate and limited operational variability. XGBoost, a gradient descent-based tree algorithm, outperforms the commonly used Feedforward Neural Networks (FNN) in terms of training speed and resource utilization for binary-classifications, as well the performance criterion in ROC-AUC score (classification), Median Absolute Error (regression) and value. Principal Component Analysis (PCA) effectively reduces the dimensionality of the data and overfitting, while retaining vital variances and significantly reducing noise. Data aggregation with separated scaling harmonizes inputs from diverse manufacturing tools and significantly improves the efficacy and versatility of combining multiple datasets to improve model performance. A live updating transfer learning approach, that periodically updates the FNN models in real-time using Stochastic Gradient Descent (SGD) with individual data points, addresses process drift, and markedly improves predictive accuracy. For the slider production tools, data augmentation with linear Mixup, overcomes a short recording period, enriches the training dataset, and significantly reduces error metrics.