低熔点金属和光固化树脂共轴三挤出机的研制。

Discover polymers Pub Date : 2025-01-01 Epub Date: 2025-05-19 DOI:10.1007/s44347-025-00021-9
Rawan Elsersawy, Mohammad Abu Hasan Khondoker
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引用次数: 0

摘要

对柔性和可拉伸电子产品的需求最近得到了高度关注。许多领域,如医药、纺织和航空航天,都需要可以安装或缝在零件上的导电元件。这意味着这种导电元件必须具有很高的柔韧性和抗变形能力。本研究提出了一种利用同轴挤压方法制造柔性电子器件的新技术,可用于可穿戴设备、生物传感器和软机器人等应用。该研究的另一个方面是将共晶镓铟、丙烯酸脂族聚氨酯弹性体树脂和Field的金属相结合,以开发柔性多功能电子设备。这项工作使用了材料的综合性能,如流动性、紫外线固化性、柔韧性和相互作用,来分析这些材料在不同挤压条件下的流变行为。使用定制设计的同轴挤压系统,同时使用g代码控制挤压参数,将这些材料精确地同时沉积在柔性基板上。研究结果验证了该方法在功能性柔性导线制造中的可行性。这种同轴挤压工艺已被证明是一种很有前途的技术,因为它具有快速原型和大规模生产的多功能性和可扩展性,因此在柔性电子领域提供了巨大的进步。补充资料:在线版本包含补充资料,提供地址:10.1007/s44347-025-00021-9。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of a co-axial tri-extruder for low-melting point metals and UV-curable resins.

The need for flexible and stretchable electronics has recently gained high focus. Many fields, such as medicine, textiles, and aerospace, require conductive elements that can be mounted or sewed to the part. This means that this conductive element must have high flexibility and resistance to deformation. This research presents a novel fabrication technique of flexible electronics using coaxial extrusion methods for applications such as wearables, biosensors, and soft robotics. Another aspect of the study is the combination of eutectic gallium-indium, Acrylated Aliphatic Urethane Elastomer Resin, and Field's metal to develop flexible and multi-functional electronic devices. This work used comprehensive material properties, such as their flowability, UV curability, and flexibility, and interactions to analyze the rheological behaviors of these materials under different extrusion conditions. These materials were precisely and simultaneously deposited onto flexible substrates using a custom-designed coaxial extrusion system, while using G-code for controlling the extrusion parameters. The findings verify the feasibility of this approach in the fabrication of functional flexible conductive wires. This coaxial extrusion process has proven to be a promising technique owing to its versatility and scalability for rapid prototyping and large-scale production, hence offering enormous advancement in flexible electronics.

Supplementary information: The online version contains supplementary material available at 10.1007/s44347-025-00021-9.

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