机器人waam铝合金厚壁中沉积策略与织构发育、几何均匀性和力学各向异性的关系

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Deepak Kumar, Sunil Jha
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引用次数: 0

摘要

本研究全面考察了沉积策略对机器人电弧增材制造(WAAM)冷金属转移气体金属弧焊(CMT-GMAW)制造的AA4043铝合金厚壁的显微组织演变、几何均匀性和力学性能的影响。利用单向和双向三角编织沉积技术,研究了热梯度和凝固动力学对晶粒形貌、织构发育、孔隙形成、硅偏析和力学各向异性的影响。采用先进的表征方法,包括场发射扫描电镜(FESEM)、x射线衍射(XRD)和能量色散x射线能谱(EDS),将微观结构特征与通过单轴拉伸试验表征的力学响应和不同取向的维氏显微硬度相关联。断裂试样的断口形貌阐明了断裂机制。结果表明,由于较高的热梯度和快速的冷却速率,单向沉积促进了更细、相对较少拉长的晶粒,提高了形核速率,导致了相对各向同性的力学性能。相反,双向沉积导致沿构建方向排列的晶粒拉长,孔隙率增加,晶界处明显的硅偏析,最终导致各向异性力学行为。由于更快的冷却速度和更精细的晶粒结构,单向沉积提高了各向同性的力学性能,而双向沉积提供了更好的几何均匀性和一致性,有效地减少了驼峰现象。由于尺寸精度在waam制造结构中至关重要,这种改进的几何一致性可以增强材料节约和可持续制造实践。这些发现背后的科学原理得到了详细的微观结构分析和机械测试的支持,包括硬度测量和拉伸测试。这些结果强调了沉积策略在定制WAAM组件的微观结构和几何特征方面的重要性,有助于优化增材制造工艺,以最小的材料浪费生产高性能金属组件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Deposition strategy correlation with texture development, geometric homogeneity, and mechanical anisotropy in robotic WAAM-fabricated aluminum alloy thick walls

Deposition strategy correlation with texture development, geometric homogeneity, and mechanical anisotropy in robotic WAAM-fabricated aluminum alloy thick walls
This research comprehensively examines the impact of deposition strategies on the microstructural evolution, geometric homogeneity, and mechanical properties of AA4043 aluminum alloy thick walls fabricated via robotic Wire Arc Additive Manufacturing (WAAM) using Cold Metal Transfer Gas Metal Arc Welding (CMT-GMAW). Utilizing unidirectional and bidirectional deposition techniques with a triangular weaving pattern, the study explores the influence of thermal gradients and solidification dynamics on grain morphology, texture development, porosity formation, silicon segregation, and mechanical anisotropy. Advanced characterization methods, including Field Emission Scanning Electron Microscopy (FESEM), X-ray Diffraction (XRD), and Energy Dispersive X-ray Spectroscopy (EDS), were employed to correlate the microstructural features with mechanical response characterized through uniaxial tensile tests and Vickers microhardness across different orientations. Fractography of fractured specimens elucidated failure mechanisms. Results indicated that unidirectional deposition promotes finer, relatively less elongated grains due to higher thermal gradients and rapid cooling rates, enhancing nucleation rates and leading to comparatively isotropic mechanical properties. In contrast, bidirectional deposition resulted in elongated grains aligned along the build direction, increased porosity, and pronounced silicon segregation at grain boundaries, culminating in anisotropic mechanical behavior. While unidirectional deposition promoted isotropic mechanical properties due to faster cooling rates and refined grain structure, bidirectional deposition offered superior geometric homogeneity and consistency, effectively minimizing the humping phenomenon. This improved geometric consistency leads to enhanced material-saving and sustainable manufacturing practices, as dimensional accuracy is critical in WAAM-fabricated structures. The scientific rationale behind these findings is supported by detailed microstructural analysis and mechanical testing, including hardness measurements and tensile testing. These results underscore the significance of deposition strategy in tailoring both the microstructure and geometric characteristics of WAAM components, contributing to the optimization of additive manufacturing processes for producing high-performance metallic components with minimal material wastage.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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