垂直构建顺序在含IN718中间层18Ni300-CuSn10结构多材料增材制造中的基本作用及其热力学机制

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Qimin Shi , Yangyang Hu , Haiyang Fan , Shoufeng Yang
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引用次数: 0

摘要

多材料激光粉末床融合(LPBF)通过将多种材料集成到预定的3D形状中来创新设计机会。然而,为了满足不同的性能/功能布局,了解材料构建序列在界面粘合中的基本作用仍然不够。利用LPBF的两种反向构建顺序,制备了具有IN718中间层的非混相CuSn10-18Ni300多材料结构,比较了它们的界面偏析和微观结构、力学性能及其背后的机制。序列1通过IN718将CuSn10打印到18Ni300上;序列II通过IN718将18Ni300打印到CuSn10上。这两个序列都产生了三种界面宏观分离形状(海滩形状、半岛形状和岛屿形状),但遵循不同的热力学机制。微观结构突出了与这些宏观偏析形状相关的痕迹,验证了机制,有趣的是,在序列I下,裂纹甚至被上部CuSn10愈合,有利于界面结合。此外,在两个序列中均观察到从18Ni300到IN718的柱状晶转变,而在CuSn10中则观察到较不明显的熔池边界。这些IN718柱要么在序列I下沿建筑方向< 001 >取向,要么在序列II下随机取向,温度梯度减小。最后,通过显微硬度演变和拉伸行为成功地评估了两种建筑结构下的结构可靠性。在顺序1下,CuSn10区域产生了良好的韧性断裂,强度为395±29 MPa,伸长率为16.6±2.6%,这得益于裂纹的愈合和界面结合的增强。相反,序列II由于残余裂纹和微应变导致中间层发生脆性断裂,拉伸性能较低。如此高的微应变甚至影响了清晰菊池带的检测。研究结果可为LPBF制造多种材料的结构序列选择和匹配结构设计提供理论依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Fundamental role of vertical building sequence and its thermodynamic mechanisms during multi-material additive manufacturing of 18Ni300-CuSn10 structures with IN718 interlayer

Fundamental role of vertical building sequence and its thermodynamic mechanisms during multi-material additive manufacturing of 18Ni300-CuSn10 structures with IN718 interlayer
Multi-material laser powder bed fusion (LPBF) innovates design opportunities by integrating multiple materials into predetermined 3D shapes. However, for satisfying the diverse performance/functional layouts, understanding the fundamental role of material building sequences in interfacial bonding is still insufficient. This work prepared multi-material structures of immiscible CuSn10-18Ni300 with an interlayer IN718 vertically, using two reversed building sequences by LPBF, to compare their interfacial segregation and microstructure, resulting mechanical properties, and behind mechanisms. Sequence I printed CuSn10 onto 18Ni300 via IN718; Sequence II printed 18Ni300 onto CuSn10 via IN718. Both sequences produce three shapes of interfacial macrosegregation (shape of beaches, peninsulas, and islands), but following different thermodynamic mechanisms. The microstructure highlights the traces related to those macrosegregation shapes, verifying the mechanism, and interestingly, the cracks are even healed by upper CuSn10 under Sequences I, benefiting interfacial bonding. Besides, a transition of cellular-columnar grains from 18Ni300 to IN718 is observed under both sequences, while less visible molten pool boundaries are seen in CuSn10. Those IN718 columns are either 〈001〉 oriented along the building direction under Sequence I, or randomly oriented under Sequence II with reduced temperature gradients. Finally, microhardness evolution and tensile behaviours successfully evaluate the structural reliability under two building sequences. A favourable ductile fracture within the CuSn10 region is produced with strength of 395 ± 29 MPa and elongation of 16.6 ± 2.6 % under Sequence I, benefiting from the healed cracks and enhanced interfacial bonding. Conversely, Sequence II causes a brittle fracture within the interlayer with lower tensile properties, due to the remaining cracks and microstrain. Such high microstrain even impacts the detection of clear Kikuchi bands. These results could enrich theoretical bases for selecting building sequences and matched structural designs for manufacturing multi-materials by LPBF.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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