高热稳定性,交联,全芳聚酮从双(乙基酮)苯的聚环三聚体

IF 3.9 3区 化学 Q2 POLYMER SCIENCE
Kazuya Sugiyama, Hiroshi Iwakiri, Takayoshi Katoh, Yoshihiro Ohta, Tsutomu Yokozawa
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引用次数: 0

摘要

为了开发可在低温下加工的高耐热树脂,我们研究了m-双(乙基酮)苯(1)的批量聚环三聚化反应,从而得到交联的全芳聚酮。1-苯基-2-丙基-1- 1(3)与仲胺催化量的环三聚化反应首次作为模型反应进行了批量研究。当30mol %的哌啶(室温下为液体)滴加到3时,反应发生爆炸并发烟。然而,固体哌嗪,而不是哌啶,可以与3混合而不发烟。1与2.5 mol%的散装哌嗪在110℃下反应24 h,得到1,3,5-三苯甲酰苯,收率83%。相应的,以2.5 mol%哌嗪为原料,在130℃、150℃、180℃下分别批量进行1的多环三聚化反应,反应时间分别为120 min。乙基转化率逐渐提高,分别达到82%、92%和96%。热重分析(TGA)表明,固化1的td5温度为426℃,高于传统的氰酸酯树脂(td5 = 410℃)或环氧树脂(td5 = 360℃)。动态力学分析(DMA)表明,固化后的1在40°C的玻璃平面区域的存储模量高达3.7 × 109 Pa,即使在380°C时也高达1.8 × 109 Pa;与氰酸酯树脂(tg = 280°C)或环氧树脂(tg = 145°C)相比,tg直到400°C才被观察到。因此,在130°C - 180°C下,1的多环三聚化得到的树脂比传统的氰酸酯树脂或环氧树脂具有更大的化学和物理耐热性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Highly Thermally Stable, Cross-Linked, All-Aromatic Polyketone From Polycyclotrimerization of Bis(Ethynylketo)phenylene in Bulk

Highly Thermally Stable, Cross-Linked, All-Aromatic Polyketone From Polycyclotrimerization of Bis(Ethynylketo)phenylene in Bulk

To develop highly heat-resistant resins that are processable at low temperatures, we investigated polycyclotrimerization of m-bis(ethynylketo)benzene (1) in bulk, leading to a cross-linked, all-aromatic polyketone. The cyclotrimerization of 1-phenyl-2-propyn-1-one (3) with a catalytic amount of secondary amine was first examined in bulk as a model reaction. When 30 mol% of piperidine, which is a liquid at room temperature, was added dropwise to 3 in bulk, the reaction proceeded explosively with fuming. However, solid piperazine, instead of piperidine, could be mixed with 3 without fuming. The reaction of 1 with 2.5 mol% of piperazine in bulk at 110°C for 24 h afforded 1,3,5-tribenzoylbenzene in 83% yield. Accordingly, the polycyclotrimerization of 1 with 2.5 mol% of piperazine was carried out in bulk at 130°C, 150°C, and then 180°C for 120 min at each temperature. The conversion of the ethynyl group gradually increased to 82%, 92%, and 96%, respectively. Thermogravimetric analysis (TGA) of cured 1 showed that T d5 was 426°C, which is higher than that of conventional cyanate ester resin (T d5 = 410°C) or epoxy resin (T d5 = 360°C). Dynamic mechanical analysis (DMA) revealed that the storage modulus of cured 1 was as high as 3.7 × 109 Pa at 40°C in the glassy flat region and was 1.8 × 109 Pa even at 380°C; T g was not observed till 400°C, in contrast to the case of cyanate ester resin (T g = 280°C) or epoxy resin (T g = 145°C). Thus, the resin obtained by polycyclotrimerization of 1 at 130°C–180°C has greater chemical and physical heat resistance than conventional cyanate ester resin or epoxy resin.

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来源期刊
Journal of Polymer Science
Journal of Polymer Science POLYMER SCIENCE-
CiteScore
6.30
自引率
5.90%
发文量
264
期刊介绍: Journal of Polymer Research provides a forum for the prompt publication of articles concerning the fundamental and applied research of polymers. Its great feature lies in the diversity of content which it encompasses, drawing together results from all aspects of polymer science and technology. As polymer research is rapidly growing around the globe, the aim of this journal is to establish itself as a significant information tool not only for the international polymer researchers in academia but also for those working in industry. The scope of the journal covers a wide range of the highly interdisciplinary field of polymer science and technology.
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