航空航天难切削合金的超声切削:现状与展望

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Xiaofei Lei , Rong Wang , Wenfeng Ding , Chuan Qian , Ziang Liu , Biao Zhao
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引用次数: 0

摘要

钛合金、高温合金、高强钢等难切削合金具有优异的力学性能,广泛应用于航空航天、军工、汽车、国家安全等重要领域。切削加工是实现难切削合金成形和制造的重要途径,但传统的切削加工往往会遇到切削力大、切削温度高、刀具磨损严重、加工表面完整性差等问题,给加工工艺带来很大的挑战。超声振动辅助切削(UVAC)是高精度、高效加工难切削合金的关键技术之一。本文以难切削合金为研究对象,综述了UVAC技术在这些金属材料中的应用及其机理。最后对金属材料UVAC存在的问题和面临的挑战进行了展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultrasonic cutting of aerospace difficult-to-cut alloys: Current status and prospects
Titanium alloys, superalloy, high-strength steels and other difficult-to-cut alloys have excellent mechanical properties and are extensively utilized in important fields like aerospace, military industry, automobiles, and national security. Cutting is an important way to achieve the forming and manufacturing of difficult-to-cut alloys, but conventional cutting (CC) machining often encounters issues like large cutting force, high cutting temperature, severe tool wear, and poor machining surface integrity, which bring great challenges to the machining process. Ultrasonic vibration assisted cutting (UVAC) is one of the key technologies for machining difficult-to-cut alloys accurately and efficiently. Taking difficult-to-cut alloys as the research object, this paper summarizes the application and mechanism of UVAC technology in these metal materials. Finally, the problems and challenges in UVAC of metal materials are prospected.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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