工业厂房架空楼板下圆片前开口统一吊舱运输车主动隔振平台

IF 4.6 2区 工程技术 Q1 CONSTRUCTION & BUILDING TECHNOLOGY
Chien-Liang Lee, Yung-Tsang Chen, Yen-Po Wang, Lap-Loi Chung, Meng-Chieh Liu, Li-Yen Lu
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引用次数: 0

摘要

本研究旨在研究在移动前开口统一吊舱(FOUP)运输车的推车台(CT)上安装的主动隔离平台(AIP)的振动控制性能,以防止在半导体晶圆厂不同建筑物之间运输过程中损坏脆弱的硅片。在此基础上,推导了在凸起地板不平整情况下的全车仿真AIP-cart系统的运动方程。此外,采用直接输出反馈控制算法确定了最优反馈增益矩阵,用于计算AIP的主动控制力。利用离散时间状态空间程序(SSP)分析了该模型在活动地板不规则性作用下的动力学时程,数值模拟结果表明,AIP能有效抑制弹跳(或垂直)加速度,降低了>;90%在FOUP位置达到2.37 m/s2 (<;9.81 m/s2或1.0 g,弹跳加速度阈值),以防止foup(或脆弱的硅片)在没有AIP的情况下从CT上弹跳,从而导致硅片碰撞损坏。此外,AIP大大降低了俯仰角旋转,减少了>;当运输foup的小车穿过膨胀节之间较大的凸起时,可防止储存foup的晶圆从foup内部的支撑槽中滑动。柔性AIP所需的控制力较小(27.08 N),显著隔离了CT传递的高频响应,并有效提高了其阻尼比,抑制了间歇射孔底板不规则或凸起引起的共振低频响应。从实际应用的角度来看,本文提出的基于CT的AIP方案可用于保护小车运输的晶圆(或类似的易碎产品)因跳跃或滑动引起的碰撞损伤,减少工业上巨大的经济损失。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Active Vibration Isolation Platforms for Wafer Front Opening Unified Pod Transporting Carts Under Raised Floor Irregularities in Industrial Factories

Active Vibration Isolation Platforms for Wafer Front Opening Unified Pod Transporting Carts Under Raised Floor Irregularities in Industrial Factories

This study was conducted to examine the vibration control performance of the active isolation platform (AIP) implemented on the cart table (CT) of a moving front opening unified pod (FOUP) transporting cart to prevent damage to fragile silicon wafers during transportation across different buildings in semiconductor fabs. Additionally, the equation of motion for the proposed AIP–cart system simulated by a full vehicle model under raised floor irregularities was derived. Moreover, the direct output feedback control algorithm was used to determine the optimal feedback gain matrix for calculating the active control forces of the AIP. Furthermore, the dynamic time histories of the proposed model under raised floor irregularities were analyzed by the discrete–time state–space procedure (SSP), and the numerical simulation results revealed that AIP effectively suppressed the bouncing (or vertical) acceleration with a reduction of > 90% at FOUP locations to 2.37 m/s2 (< 9.81 m/s2 or 1.0 g, the bouncing acceleration threshold) to prevent FOUPs (or fragile silicon wafers) from bouncing away from the CT without AIP, causing damages to the wafers via collisions. Moreover, AIP greatly reduced the pitching angular rotation with a reduction of > 65% to prevent the sliding of FOUP-stored wafers from the supporting slots inside FOUPs when the FOUP-transporting cart traversed through a larger bump between the expansion joints. The flexible AIP that demanded less control force (27.08 N) significantly isolated the high-frequency response transmitted from the CT and effectively enhanced its damping ratio to suppress the resonance low-frequency response induced by intermittent perforated floor irregularities or bumps. From a practical point of view, the proposed AIP scheme implemented on CT can be adopted for protecting jumping- or sliding-induced collision damages to wafers (or similar fragile products) transported by carts to reduce huge economic losses in industry.

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来源期刊
Structural Control & Health Monitoring
Structural Control & Health Monitoring 工程技术-工程:土木
CiteScore
9.50
自引率
13.00%
发文量
234
审稿时长
8 months
期刊介绍: The Journal Structural Control and Health Monitoring encompasses all theoretical and technological aspects of structural control, structural health monitoring theory and smart materials and structures. The journal focuses on aerospace, civil, infrastructure and mechanical engineering applications. Original contributions based on analytical, computational and experimental methods are solicited in three main areas: monitoring, control, and smart materials and structures, covering subjects such as system identification, health monitoring, health diagnostics, multi-functional materials, signal processing, sensor technology, passive, active and semi active control schemes and implementations, shape memory alloys, piezoelectrics and mechatronics. Also of interest are actuator design, dynamic systems, dynamic stability, artificial intelligence tools, data acquisition, wireless communications, measurements, MEMS/NEMS sensors for local damage detection, optical fibre sensors for health monitoring, remote control of monitoring systems, sensor-logger combinations for mobile applications, corrosion sensors, scour indicators and experimental techniques.
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