非晶聚乙烯的粗粒度建模及多性能模拟

IF 3.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Xueming Yang , Tianfu Yu , Xiaozhong Zhang , Yongfu Ma , Jianfei Xie
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引用次数: 0

摘要

本文建立了非晶聚乙烯(PE)的粗粒模型,并推导了粗粒模型的电位参数。因此,采用粗粒分子动力学(CGMD)模拟方法研究了非晶PE的密度、玻璃化转变温度(Tg)、力学和热性能等多种性能。采用迭代玻尔兹曼反演(IBI)方法推导了CG模型的势能参数,得到的键长、键角和对分布与全原子分子动力学(AAMD)模拟结果吻合较好。利用所得电位参数可以准确再现非晶PE的密度、Tg和力学性能,但CG模型返回的导热系数仅为实际值的1/2。此外,还讨论了导热系数较低的原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Coarse-grained modeling and multi-properties simulation of amorphous polyethylene

Coarse-grained modeling and multi-properties simulation of amorphous polyethylene
In this paper, a coarse-grained (CG) model of amorphous polyethylene (PE) has been developed, and the potential parameters of CG have also been derived. Accordingly, the multi-properties of amorphous PE such as its density, glass transition temperature (Tg), mechanical and thermal properties are studied by using Coarse-Grained Molecular Dynamics (CGMD) simulations. The potential parameters of CG model have been derived via an iterative Boltzmann inversion (IBI) method, and the bond lengths, bond angles and pair distributions obtained in CGMD simulations match well with those obtained in all-atom molecular dynamics (AAMD) simulations. The obtained potential parameters can be utilized to accurately reproduce the density, Tg and mechanical properties of amorphous PE, but the thermal conductivity returned by the CG model is only 1/2 of the actual value. Furthermore, the reasons for the lower thermal conductivity are discussed.
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来源期刊
Computational Materials Science
Computational Materials Science 工程技术-材料科学:综合
CiteScore
6.50
自引率
6.10%
发文量
665
审稿时长
26 days
期刊介绍: The goal of Computational Materials Science is to report on results that provide new or unique insights into, or significantly expand our understanding of, the properties of materials or phenomena associated with their design, synthesis, processing, characterization, and utilization. To be relevant to the journal, the results should be applied or applicable to specific material systems that are discussed within the submission.
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