基于关断栅极电压欠冲和过冲的多芯片 IGBT 功率模块中芯片故障度评估方法

IF 4.6 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Mingchao Zhou, Lei Wang, Lijun Diao, Yanbei Sha, Ningning Wei, Zheming Jin, Benchao Zhu
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Die Failure Degree Evaluation Method in Multi-Die IGBT Power Modules Based on Turn-Off Gate Voltage Undershoot and Overshoot
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来源期刊
CiteScore
12.50
自引率
9.10%
发文量
547
审稿时长
3 months
期刊介绍: The aim of the journal is to enable the power electronics community to address the emerging and selected topics in power electronics in an agile fashion. It is a forum where multidisciplinary and discriminating technologies and applications are discussed by and for both practitioners and researchers on timely topics in power electronics from components to systems.
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