A slope-based J-integral approach and advanced image processing for assessment of the cyclic fatigue delamination behavior of adhesive joints

A fatigue fracture mechanics methodology was developed and established, employing a slope-based J-integral approach combined with advanced image processing techniques. Adhesively bonded double cantilever beam (DCB) specimens were tested under constant displacement amplitude loading. The beam rotation was tracked by affixing a repetitive pattern on the DCB specimens and capturing images at the maximum displacement amplitude. Using a custom-developed image processing procedure, the beam rotation was deduced. To validate the methodology, DCB fatigue experiments were conducted at 23, 60 and 75 °C on aluminum adherends bonded with a structural 2-K epoxy adhesive. The J-based approach was compared with a conventional, compliance-based linear elastic fracture mechanics (LEFM) method. The epoxy was a rather brittle, high-modulus adhesive with a bond line thickness of 0.25 mm, resulting in predominantly linear elastic material behavior. By analyzing the images taken during fatigue testing, a stiffening effect of the steel load blocks was observed. Excluding pattern elements directly below the load block yielded the best agreement between J-integral and LEFM data. Both approaches were in excellent agreement within the investigated temperature range. The investigated adhesive exhibited a highly temperature-dependent behavior, which was associated with higher crack propagation rates and a lower fatigue threshold at 60 and 75 °C.