{"title":"封面图片,第 39 卷第 23 期","authors":"","doi":"10.1111/mice.13380","DOIUrl":null,"url":null,"abstract":"<p><b>The cover image</b> is based on the Article <i>A multi-phase mechanical model of biochar–cement composites at the mesoscale</i> by Muduo Li et al., https://doi.org/10.1111/mice.13307.\n\n <figure>\n <div><picture>\n <source></source></picture><p></p>\n </div>\n </figure>\n </p>","PeriodicalId":156,"journal":{"name":"Computer-Aided Civil and Infrastructure Engineering","volume":"39 23","pages":""},"PeriodicalIF":8.5000,"publicationDate":"2024-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1111/mice.13380","citationCount":"0","resultStr":"{\"title\":\"Cover Image, Volume 39, Issue 23\",\"authors\":\"\",\"doi\":\"10.1111/mice.13380\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><b>The cover image</b> is based on the Article <i>A multi-phase mechanical model of biochar–cement composites at the mesoscale</i> by Muduo Li et al., https://doi.org/10.1111/mice.13307.\\n\\n <figure>\\n <div><picture>\\n <source></source></picture><p></p>\\n </div>\\n </figure>\\n </p>\",\"PeriodicalId\":156,\"journal\":{\"name\":\"Computer-Aided Civil and Infrastructure Engineering\",\"volume\":\"39 23\",\"pages\":\"\"},\"PeriodicalIF\":8.5000,\"publicationDate\":\"2024-11-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1111/mice.13380\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Computer-Aided Civil and Infrastructure Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1111/mice.13380\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Computer-Aided Civil and Infrastructure Engineering","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1111/mice.13380","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS","Score":null,"Total":0}
引用次数: 0
摘要
封面图片来自 Muduo Li 等人撰写的《中尺度生物炭-水泥复合材料的多相力学模型》一文,https://doi.org/10.1111/mice.13307。
The cover image is based on the Article A multi-phase mechanical model of biochar–cement composites at the mesoscale by Muduo Li et al., https://doi.org/10.1111/mice.13307.
期刊介绍:
Computer-Aided Civil and Infrastructure Engineering stands as a scholarly, peer-reviewed archival journal, serving as a vital link between advancements in computer technology and civil and infrastructure engineering. The journal serves as a distinctive platform for the publication of original articles, spotlighting novel computational techniques and inventive applications of computers. Specifically, it concentrates on recent progress in computer and information technologies, fostering the development and application of emerging computing paradigms.
Encompassing a broad scope, the journal addresses bridge, construction, environmental, highway, geotechnical, structural, transportation, and water resources engineering. It extends its reach to the management of infrastructure systems, covering domains such as highways, bridges, pavements, airports, and utilities. The journal delves into areas like artificial intelligence, cognitive modeling, concurrent engineering, database management, distributed computing, evolutionary computing, fuzzy logic, genetic algorithms, geometric modeling, internet-based technologies, knowledge discovery and engineering, machine learning, mobile computing, multimedia technologies, networking, neural network computing, optimization and search, parallel processing, robotics, smart structures, software engineering, virtual reality, and visualization techniques.