通过激光辅助轧制对脆性多晶材料进行表面改性

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Kaiyuan You , Wei Wang , Bei Peng , Min Lai , Hai Jiang
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引用次数: 0

摘要

本研究提出了一种新的表面改性方法--激光辅助轧制,旨在细化脆性多晶材料的表面晶粒并提高其可加工性。这种方法为实现无裂纹、低损伤的光学表面处理奠定了基础。以无粘结剂碳化钨为例,利用自主研发的激光辅助轧制系统进行了系统的实验研究。结果表明,所提出的方法通过引入致密缺陷有效地细化了表面晶粒。它还实现了梯度晶粒大小的晶体结构和残余压应力状态,且不会造成表面裂纹。对改性层的形成和演化机制进行了全面研究。此外,这种新方法有望为其他脆性多晶材料的表面改性提供理论指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Surface modification of brittle polycrystalline materials by laser-assisted rolling
This study proposes a novel surface modification method known as laser-assisted rolling, which aims to refine surface grains and enhance the machinability of brittle polycrystalline materials. This method establishes a foundation for achieving a crack-free and low-damage optical surface finish. Using binderless tungsten carbide as a case study, a systematic experimental investigation was carried out with a self-developed laser-assisted rolling system. The results show that the proposed method effectively refines surface grains by introducing dense defects. It also achieves a gradient grain size crystal structure and a residual compressive stress state without causing surface cracks. The formation and evolution mechanisms of the modified layer were comprehensively studied. Moreover, this novel method is expected to offer theoretical guidance for the surface modification of other brittle polycrystalline materials.
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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