浪涌条件下线键合功率芯片的三维电热耦合温度评估模型

IF 6.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Feilin Zheng, Binqi Liang, Xiang Cui, Xuebao Li, Lei Qi
{"title":"浪涌条件下线键合功率芯片的三维电热耦合温度评估模型","authors":"Feilin Zheng, Binqi Liang, Xiang Cui, Xuebao Li, Lei Qi","doi":"10.1109/tpel.2024.3492917","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13267,"journal":{"name":"IEEE Transactions on Power Electronics","volume":null,"pages":null},"PeriodicalIF":6.6000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Three-Dimensional Electro-Thermal Coupling Temperature Evaluation Modeling of Wire-Bonded Power Chips under Surge Conditions\",\"authors\":\"Feilin Zheng, Binqi Liang, Xiang Cui, Xuebao Li, Lei Qi\",\"doi\":\"10.1109/tpel.2024.3492917\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":13267,\"journal\":{\"name\":\"IEEE Transactions on Power Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":6.6000,\"publicationDate\":\"2024-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Power Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/tpel.2024.3492917\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/tpel.2024.3492917","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文章由计算机程序翻译,如有差异,请以英文原文为准。
Three-Dimensional Electro-Thermal Coupling Temperature Evaluation Modeling of Wire-Bonded Power Chips under Surge Conditions
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Transactions on Power Electronics
IEEE Transactions on Power Electronics 工程技术-工程:电子与电气
CiteScore
15.20
自引率
20.90%
发文量
1099
审稿时长
3 months
期刊介绍: The IEEE Transactions on Power Electronics journal covers all issues of widespread or generic interest to engineers who work in the field of power electronics. The Journal editors will enforce standards and a review policy equivalent to the IEEE Transactions, and only papers of high technical quality will be accepted. Papers which treat new and novel device, circuit or system issues which are of generic interest to power electronics engineers are published. Papers which are not within the scope of this Journal will be forwarded to the appropriate IEEE Journal or Transactions editors. Examples of papers which would be more appropriately published in other Journals or Transactions include: 1) Papers describing semiconductor or electron device physics. These papers would be more appropriate for the IEEE Transactions on Electron Devices. 2) Papers describing applications in specific areas: e.g., industry, instrumentation, utility power systems, aerospace, industrial electronics, etc. These papers would be more appropriate for the Transactions of the Society which is concerned with these applications. 3) Papers describing magnetic materials and magnetic device physics. These papers would be more appropriate for the IEEE Transactions on Magnetics. 4) Papers on machine theory. These papers would be more appropriate for the IEEE Transactions on Power Systems. While original papers of significant technical content will comprise the major portion of the Journal, tutorial papers and papers of historical value are also reviewed for publication.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信