带有碳纤维织物预浸料的层状聚合物复合材料(聚醚醚酮/聚醚酰亚胺,PEEK/PEI)疲劳降解的数字图像相关性分析

IF 1.8 4区 材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
S. V. Panin, A. A. Bogdanov, V. O. Aleksenko, S. A. Bochkareva, P. S. Lyubutin, I. L. Panov, D. Tian
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引用次数: 0

摘要

在这项工作中,通过分析使用数字图像相关技术计算的机械滞后环参数的时间变化,研究了由聚醚酰亚胺(PEEK)板/聚醚酰亚胺(PEEK)薄膜/聚醚酰亚胺浸渍碳纤维织物预浸料/聚醚酰亚胺(PEEK)薄膜/聚醚酰亚胺(PEEK)板组成的层状复合材料的结构与抗循环加载能力之间的关系。结果表明,聚醚酰亚胺基分层复合材料在循环加载(屈服强度的 0.8)下的疲劳寿命较低,这是由于低熔点 TecaPEI 薄膜形成的层界面导致 PEI 板和预浸料之间的不相容变形造成的。而在 PEEK 分层复合材料中,层界面是由纯 PEEK 能量导向器形成的,因此存在少量缺陷,因此载荷能很好地从 PEEK 板转移到中间增强层。因此,在屈服强度为 0.8 的载荷水平下,疲劳寿命相当于高循环疲劳(超过 86000 个循环)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Digital Image Correlation Analysis of Fatigue Degradation of Layered Polymer Composites (Polyetheretherketone/Polyetherimide, PEEK/PEI) with Carbon-Fiber Fabric Prepreg

In this work, the relationship was considered between the structure and cyclic loading resistance of a layered composite consisting of PEI (PEEK) plate/PEI (PEEK) film/PEI-impregnated carbon-fiber fabric prepreg/PEI (PEEK) film/PEI (PEEK) plate by analyzing the time variation in the parameters of mechanical hysteresis loops calculated using digital image correlation. It was shown that the polyetherimide-based layered composite has low fatigue life under cyclic loading (0.8 of the yield strength), resulting from incompatible deformation between the PEI plates and the prepreg due to a layer interface formed by low-melting TecaPEI film. In the PEEK layered composite, the layer interface was formed by neat PEEK energy director and therefore had a little amount of defects, due to which the load was well transferred from the PEEK plates to the middle reinforcement layer. As a result, the fatigue life at a load level of 0.8 of the yield strength corresponded to high-cycle fatigue (more than 86000 cycles).

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来源期刊
Physical Mesomechanics
Physical Mesomechanics Materials Science-General Materials Science
CiteScore
3.50
自引率
18.80%
发文量
48
期刊介绍: The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.
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