公告栏：IEEE DEIS 2026 国际电介质会议（2026 年 6 月 21-25 日）

IF 2.6 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electrical Insulation Magazine Pub Date : 2024-10-17 DOI:10.1109/MEI.2024.10721389

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引用次数: 0

摘要

备受瞩目的第六届国际电介质会议（ICD）将于 2026 年 6 月 21 日（星期日）至 6 月 25 日（星期四）在英国南安普顿召开。这一久负盛名的会议由电气和电子工程师学会（IEEE）电介质和电气绝缘协会主办，由备受推崇的固体电介质传导和击穿国际会议（ICSD）发展而来。它扩大了会议范围，将液态和气态电介质都包括在内，反映了该领域的最新进展。

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Bulletin Board: IEEE DEIS 2026 International Conference on Dielectrics (June 21–25, 2026)

The highly anticipated sixth edition of the International Conference of Dielectrics (ICD) is set to convene in Southampton, United Kingdom, from Sunday, June 21, through Thursday, June 25, 2026. This prestigious conference, sponsored by the IEEE Dielectrics and Electrical Insulation Society, has evolved from the esteemed International Conference on Conduction and Breakdown in Solid Dielectrics (ICSD). It broadens its scope to include both liquid and gaseous dielectrics, reflecting the latest advancements in the field.

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来源期刊

IEEE Electrical Insulation Magazine 工程技术-工程：电子与电气

CiteScore

4.60

自引率

3.40%

发文量

121

审稿时长

>12 weeks

期刊介绍： The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions. Usually three articles are published in each issue. The articles deal with dielectric materials, processes and new developments applied to industry products. Also the EI Magazine is used to promote upcoming conferences and solicits papers for the conferences. In addition, reports on past conferences are given in many issues. Book reviews and news items are included. An editorial is written by both the EIC and the President of DEIS in alternate issues. Advertising of insulation products appears in many issues.