CMOS 技术中的无电感器低功耗低电压交叉耦合稳压级联跨阻抗放大器电路

IF 3.4 3区 计算机科学 Q2 COMPUTER SCIENCE, INFORMATION SYSTEMS
Behnam Abdollahi;Baset Mesgari;Saeed Saeedi;Zahra Sohrabi;Bernhard Goll;Horst Zimmermann
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引用次数: 0

摘要

本文介绍了一种无电感器、低功耗、低电压交叉耦合稳压级联(LV CC-RGC)跨阻抗放大器(TIA)设计拓扑,除了传统的 gm 升压方法外,还采用了负电阻。结合上述技术可提高设计灵活性,而无需使用片上电感器和额外功耗。当一个大型光电二极管 (PD) 的电容位于 TIA 输入端时,这种方法尤其有效。TIA 采用 0.35~\mu $ m CMOS 技术实现,最大频率为 20 GHz。实验结果表明,跨阻增益为 60 dB,3-dB 带宽为 1.8 GHz,平均输入参考噪声电流谱密度为 9.2 pA/ $\surd $ Hz。电路功耗和芯片面积分别为 2.2 mW 和 0.004 mm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Inductor-Less Low-Power Low-Voltage Cross-Coupled Regulated-Cascode Transimpedance Amplifier Circuit in CMOS Technology
This paper presents an inductor-less low-power low-voltage cross-coupled regulated cascode (LV CC-RGC) transimpedance amplifier (TIA) design topology with a negative resistance in addition to the traditional gm-boosting approach. Combining the above techniques leads to enhanced design flexibility without needing an on-chip inductor and extra power consumption. It is particularly beneficial as well when the capacitance of a large photodiode (PD) is located at the TIA input. The TIA is implemented in $0.35~\mu $ m CMOS technology with a maximum ft of 20 GHz. Experimental results demonstrate a transimpedance gain of 60 dB $\Omega $ , a 3-dB bandwidth of 1.8 GHz, and an average input-referred noise current spectral density of 9.2 pA/ $\surd $ Hz. The circuit’s power consumption and chip area are 2.2 mW and 0.004 mm2, respectively.
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来源期刊
IEEE Access
IEEE Access COMPUTER SCIENCE, INFORMATION SYSTEMSENGIN-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
9.80
自引率
7.70%
发文量
6673
审稿时长
6 weeks
期刊介绍: IEEE Access® is a multidisciplinary, open access (OA), applications-oriented, all-electronic archival journal that continuously presents the results of original research or development across all of IEEE''s fields of interest. IEEE Access will publish articles that are of high interest to readers, original, technically correct, and clearly presented. Supported by author publication charges (APC), its hallmarks are a rapid peer review and publication process with open access to all readers. Unlike IEEE''s traditional Transactions or Journals, reviews are "binary", in that reviewers will either Accept or Reject an article in the form it is submitted in order to achieve rapid turnaround. Especially encouraged are submissions on: Multidisciplinary topics, or applications-oriented articles and negative results that do not fit within the scope of IEEE''s traditional journals. Practical articles discussing new experiments or measurement techniques, interesting solutions to engineering. Development of new or improved fabrication or manufacturing techniques. Reviews or survey articles of new or evolving fields oriented to assist others in understanding the new area.
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