{"title":"使用 Cu-Mo30Cu-Ti 复合箔作为热界面材料,实现 Cf/C 和 Haynes 230 的高导热连接","authors":"","doi":"10.1016/j.jmapro.2024.08.042","DOIUrl":null,"url":null,"abstract":"<div><p>Haynes 230 is widely used in high-temperature regions in the aerospace field. However, the long-term exposure to high-temperature environments results in catastrophic structural failures. Therefore, how to make the heat evacuate quickly and efficiently has become an urgent problem to be solved. Here, we have investigated for the first time the use of Cu-Mo30Cu-Ti composite foil as a thermal interface material to join the C<sub>f</sub>/C composite and Haynes 230 in the form of brazing to attain stable operation of the component. The results show that the Cu-Mo30Cu-Ti composite foils form a metallurgical joining with the matrix materials and construct a heat transfer channel between them. When the brazing parameter reaches 1220 °C for 10 min, the thermal conductivity (29.9–34.8 W·m<sup>−1</sup>·K<sup>−1</sup>, testing in the range of 600–900 °C) of the joint is improved by 500 % ~ 600 % compared with that before brazing (4.5–5.5 W·m<sup>−1</sup>·K<sup>−1</sup>). Our work provides some references to promote the application of C<sub>f</sub>/C composite and Haynes 230 in future high-temperature thermal management.</p></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":6.1000,"publicationDate":"2024-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Achieving high thermal conductivity joining of Cf/C and Haynes 230 by using Cu-Mo30Cu-Ti composite foil as thermal interface material\",\"authors\":\"\",\"doi\":\"10.1016/j.jmapro.2024.08.042\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Haynes 230 is widely used in high-temperature regions in the aerospace field. However, the long-term exposure to high-temperature environments results in catastrophic structural failures. Therefore, how to make the heat evacuate quickly and efficiently has become an urgent problem to be solved. Here, we have investigated for the first time the use of Cu-Mo30Cu-Ti composite foil as a thermal interface material to join the C<sub>f</sub>/C composite and Haynes 230 in the form of brazing to attain stable operation of the component. The results show that the Cu-Mo30Cu-Ti composite foils form a metallurgical joining with the matrix materials and construct a heat transfer channel between them. When the brazing parameter reaches 1220 °C for 10 min, the thermal conductivity (29.9–34.8 W·m<sup>−1</sup>·K<sup>−1</sup>, testing in the range of 600–900 °C) of the joint is improved by 500 % ~ 600 % compared with that before brazing (4.5–5.5 W·m<sup>−1</sup>·K<sup>−1</sup>). Our work provides some references to promote the application of C<sub>f</sub>/C composite and Haynes 230 in future high-temperature thermal management.</p></div>\",\"PeriodicalId\":16148,\"journal\":{\"name\":\"Journal of Manufacturing Processes\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":6.1000,\"publicationDate\":\"2024-09-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Manufacturing Processes\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1526612524008739\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524008739","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Achieving high thermal conductivity joining of Cf/C and Haynes 230 by using Cu-Mo30Cu-Ti composite foil as thermal interface material
Haynes 230 is widely used in high-temperature regions in the aerospace field. However, the long-term exposure to high-temperature environments results in catastrophic structural failures. Therefore, how to make the heat evacuate quickly and efficiently has become an urgent problem to be solved. Here, we have investigated for the first time the use of Cu-Mo30Cu-Ti composite foil as a thermal interface material to join the Cf/C composite and Haynes 230 in the form of brazing to attain stable operation of the component. The results show that the Cu-Mo30Cu-Ti composite foils form a metallurgical joining with the matrix materials and construct a heat transfer channel between them. When the brazing parameter reaches 1220 °C for 10 min, the thermal conductivity (29.9–34.8 W·m−1·K−1, testing in the range of 600–900 °C) of the joint is improved by 500 % ~ 600 % compared with that before brazing (4.5–5.5 W·m−1·K−1). Our work provides some references to promote the application of Cf/C composite and Haynes 230 in future high-temperature thermal management.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.