带浮雕能量导向器的连续碳纤维增强聚醚醚酮的超声波焊接

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
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引用次数: 0

摘要

超声波塑料焊接(UPW)是一种高效、环保的碳纤维增强热塑性塑料(CFRTP)连接方法。超音波塑料焊接(UPW)的一个重要方面是能量导向器(ED)的设计。在本研究中,采用超声波压花技术处理平面 ED,以获得一种新型 ED,即压花 ED。研究从拉伸剪切性能、宏观和微观形态以及断裂形态等方面考察了压花 ED 对连续碳纤维增强 PEEK 超声波焊接接头形成的影响。结果表明,使用压花 ED 可以使焊接界面的温度分布更加均匀,从而显著减少接头缺陷。与使用平面电解质相比,使用压花电解质可将焊接接头的失效载荷提高约 50%(高达 39.6 兆帕),并减少接头质量的变化。在最佳条件下,使用压花 ED 制作的接头会出现母材层间破坏。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultrasonic welding of continuous carbon fiber reinforced PEEK with embossed energy directors

Ultrasonic plastic welding (UPW) is an efficient and environmentally friendly method for joining carbon fiber reinforced thermoplastic (CFRTP). A crucial aspect of UPW is the design of the energy director (ED). In this study, ultrasonic embossing technology was used to process flat EDs to obtain a new type of ED, named embossed ED. The effect of embossed EDs on the joint formation in ultrasonic welding of continuous carbon fiber reinforced PEEK was investigated in terms of tensile shear properties, macro and micro-morphologies, and fracture morphology. The results show that the use of embossed EDs makes a more homogeneous temperature distribution at the welding interface which significantly reduces defects in the joint. The use of embossed EDs increases the failure load of welded joints by about 50 % (up to 39.6 MPa) and reduces the variation of the joint quality compared with the use of flat EDs. In the optimal condition, the joints made with embossed EDs experiences interlaminar failure of the base material.

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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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