第六届 IBM IEEE CAS/EDS 人工智能计算研讨会（AICS'23） [CASS 会议要点］

IF 5.6 2区工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Circuits and Systems Magazine Pub Date : 2024-08-19 DOI:10.1109/mcas.2024.3395580

Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui

{"title":"第六届 IBM IEEE CAS/EDS 人工智能计算研讨会（AICS'23） [CASS 会议要点］","authors":"Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui","doi":"10.1109/mcas.2024.3395580","DOIUrl":null,"url":null,"abstract":"The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"5 1","pages":""},"PeriodicalIF":5.6000,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"6th IBM IEEE CAS/EDS AI Compute Symposium (AICS’23) [CASS Conference Highlights]\",\"authors\":\"Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui\",\"doi\":\"10.1109/mcas.2024.3395580\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.\",\"PeriodicalId\":55038,\"journal\":{\"name\":\"IEEE Circuits and Systems Magazine\",\"volume\":\"5 1\",\"pages\":\"\"},\"PeriodicalIF\":5.6000,\"publicationDate\":\"2024-08-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Circuits and Systems Magazine\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/mcas.2024.3395580\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Circuits and Systems Magazine","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mcas.2024.3395580","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

第六届 IBM IEEE CAS/EDS 人工智能计算研讨会于 2023 年 11 月 28 日在 T. J. 沃森研究中心举行。来自世界各地的 2000 多人（现场和虚拟）参加了此次活动，活动非常成功。研讨会邀请了 8 位杰出的演讲者（7 位来自工业界，1 位来自学术界）、30 多位学生亲自展示海报、最佳海报奖和小组讨论。注册名单涵盖 53 个国家的公民。研讨会的主题是 "从芯片到芯片组"，这对当前半导体行业的发展方向来说是一个恰当而重要的主题。这次研讨会对全球的工业界、学术界和学生来说既是一次教育会议，也是一次头脑风暴会议。研讨会涵盖了一系列主题，包括新兴器件技术、创新电路、芯片和芯片组架构、先进封装技术（如从 2D 到 3D 封装元件），以及这些主题如何推动人工智能和生成式人工智能的快速发展。大会总主席、IEEE 终身会士 Rajiv Joshi 博士在开幕式上致欢迎辞，并介绍了由中科院和 IBM 赞助的本次研讨会的目标和成就。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

6th IBM IEEE CAS/EDS AI Compute Symposium (AICS’23) [CASS Conference Highlights]

The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Circuits and Systems Magazine 工程技术-工程：电子与电气

CiteScore

9.30

自引率

1.40%

发文量

审稿时长

>12 weeks

期刊介绍： The IEEE Circuits and Systems Magazine covers the subject areas represented by the Society's transactions, including: analog, passive, switch capacitor, and digital filters; electronic circuits, networks, graph theory, and RF communication circuits; system theory; discrete, IC, and VLSI circuit design; multidimensional circuits and systems; large-scale systems and power networks; nonlinear circuits and systems, wavelets, filter banks, and applications; neural networks; and signal processing. Content also covers the areas represented by the Society technical committees: analog signal processing, cellular neural networks and array computing, circuits and systems for communications, computer-aided network design, digital signal processing, multimedia systems and applications, neural systems and applications, nonlinear circuits and systems, power systems and power electronics and circuits, sensors and micromaching, visual signal processing and communication, and VLSI systems and applications. Lastly, the magazine covers the interests represented by the widespread conference activity of the IEEE Circuits and Systems Society. In addition to the technical articles, the magazine also covers Society administrative activities, as for instance the meetings of the Board of Governors, Society People, as for instance the stories of award winners-fellows, medalists, and so forth, and Places reached by the Society, including readable reports from the Society's conferences around the world.