微型 LED 显示屏制造中激光加工技术的最新进展:综述

Lingxiao Song, Xuechao Yong, Peilei Zhang, Shijie Song, Kefan Chen, Hua Yan, Tianzhu Sun, Qinghua Lu, Haichuan Shi, Yu Chen, Yuze Huang
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引用次数: 0

摘要

Micro-LED 无疑是未来显示技术创新中备受瞩目的一项技术。Micro-LED 技术通过在基板上单独组装微型发光二极管,在色彩表现、能效和灵活性方面超越了传统显示技术。Micro-LED 技术是 LED 的进一步发展,因其出色的亮度、高对比度和极高的像素密度,被认为是最有前途的下一代显示技术。激光技术在 Micro-LED 显示屏中的应用正日益成为研究和产业界的焦点。作为一种高度集成的光源,激光在 Micro-LED 应用中具有独特的优势,包括高能量密度加工、非接触加工、精确的微结构加工和雕刻能力、高效封装以及更高的器件质量和可靠性。这些优势为实现 Micro-LED 芯片的高精度制造和装配提供了独特的优势。激光外延基底技术利用激光加热和材料沉积在基底上生长 Micro-LED 芯片。激光蚀刻技术实现了对激光的精确控制,从而能够对 Micro-LED 器件进行微结构加工和雕刻。激光剥离技术利用激光诱导 GaN 分解来剥离底层材料,从而实现 Micro-LED 的分离。激光大规模转移技术利用激光的能量将 Micro-LED 从基底迅速准确地转移到目标基底,从而实现快速的器件转移。最后,激光修复技术用于检测和修复 Micro-LED 的潜在缺陷,从而提高器件的质量和可靠性。通过利用激光,我们有望在 Micro-LED 领域实现更高的生产效率、更精确的器件制造和更优越的光电性能,从而为未来的显示技术和照明应用带来更广阔的前景。这些激光技术为 Micro-LED 设备的高精度和高效率生产提供了新的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent progress of laser processing technology in micro-LED display manufacturing: A review
Micro-LED undoubtedly stands out as a highly anticipated technology when it comes to the innovation of future display technologies. Micro-LED technology surpasses traditional display technologies regarding color representation, energy efficiency, and flexibility by individually assembling tiny light-emitting diodes on a substrate. Micro-LED technology, a further evolution of LED, is considered the most promising next-generation display technology due to its outstanding brightness, high contrast ratio, and extremely high pixel density. The application of laser technology in Micro-LED displays is increasingly becoming a focus of research and industry. As a highly integrated light source, lasers offer unique advantages in Micro-LED applications, including high-energy density processing, non-contact processing, precise microstructure processing and sculpting capability, efficient packaging, and improved device quality and reliability. These advantages provide a distinctive edge in achieving high-precision manufacturing and assembly of Micro-LED chips. Laser epitaxy substrate technology utilizes laser heating and material deposition to grow Micro-LED chips on a substrate. Laser etching technology achieves precise control of lasers to enable microstructure processing and sculpting of Micro-LED devices. Laser lift-off technology utilizes laser-induced decomposition of GaN to peel off the underlying material, allowing for the separation of Micro-LEDs. Laser-based massive transfer technology uses the energy of lasers to swiftly and accurately transfer Micro-LEDs from the substrate to the target substrate, enabling rapid device transfer. Lastly, laser repair technology is employed for the detection and repair of potential defects in Micro-LEDs, enhancing device quality and reliability. By utilizing lasers, we can expect to achieve higher production efficiency, more precise device manufacturing, and superior optoelectronic performance in the field of Micro-LED, thereby presenting broader prospects for future display technology and lighting applications. These laser technologies provide new solutions for Micro-LED devices’ high-precision and high-efficiency production.
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