基于深度神经网络的电子设备散热器温度映射技术(使用本地热电偶传感器

IF 2.9 4区 计算机科学 Q2 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE
Jaehee Shin, Hyun Ahn, Gwang-Hyeon Mun, Jeongmin Lee, Pouria Zaghari, Young-Min Park, Jinhyoung Park, Jong Eun Ryu, Dong-Won Jang
{"title":"基于深度神经网络的电子设备散热器温度映射技术(使用本地热电偶传感器","authors":"Jaehee Shin, Hyun Ahn, Gwang-Hyeon Mun, Jeongmin Lee, Pouria Zaghari, Young-Min Park, Jinhyoung Park, Jong Eun Ryu, Dong-Won Jang","doi":"10.1080/08839514.2024.2389374","DOIUrl":null,"url":null,"abstract":"Heat generated by electronic devices can lead to thermal deformation, damage, and fatigue failure, underscoring the importance of monitoring heat distribution. This study introduces an artificial n...","PeriodicalId":8260,"journal":{"name":"Applied Artificial Intelligence","volume":"170 1","pages":""},"PeriodicalIF":2.9000,"publicationDate":"2024-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors\",\"authors\":\"Jaehee Shin, Hyun Ahn, Gwang-Hyeon Mun, Jeongmin Lee, Pouria Zaghari, Young-Min Park, Jinhyoung Park, Jong Eun Ryu, Dong-Won Jang\",\"doi\":\"10.1080/08839514.2024.2389374\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Heat generated by electronic devices can lead to thermal deformation, damage, and fatigue failure, underscoring the importance of monitoring heat distribution. This study introduces an artificial n...\",\"PeriodicalId\":8260,\"journal\":{\"name\":\"Applied Artificial Intelligence\",\"volume\":\"170 1\",\"pages\":\"\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Artificial Intelligence\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1080/08839514.2024.2389374\",\"RegionNum\":4,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Artificial Intelligence","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1080/08839514.2024.2389374","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE","Score":null,"Total":0}
引用次数: 0

摘要

电子设备产生的热量会导致热变形、损坏和疲劳失效,这凸显了监测热量分布的重要性。本研究引入了一种人工...
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors
Heat generated by electronic devices can lead to thermal deformation, damage, and fatigue failure, underscoring the importance of monitoring heat distribution. This study introduces an artificial n...
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来源期刊
Applied Artificial Intelligence
Applied Artificial Intelligence 工程技术-工程:电子与电气
CiteScore
5.20
自引率
3.60%
发文量
106
审稿时长
6 months
期刊介绍: Applied Artificial Intelligence addresses concerns in applied research and applications of artificial intelligence (AI). The journal also acts as a medium for exchanging ideas and thoughts about impacts of AI research. Articles highlight advances in uses of AI systems for solving tasks in management, industry, engineering, administration, and education; evaluations of existing AI systems and tools, emphasizing comparative studies and user experiences; and the economic, social, and cultural impacts of AI. Papers on key applications, highlighting methods, time schedules, person-months needed, and other relevant material are welcome.
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