Heat transport in SiCOH thin films: an experimental and molecular dynamics study

Carbon-doped silicon dioxide (SiCOH) film is currently regarded as one of the most promising low-k materials in the integrated circuits (ICs) industry for advanced technology nodes. However, there have been limited studies on the thermal properties of SiCOH compared to its electrical and mechanical properties. In this study, we investigate the thermal conductivity of SiCOH thin films through molecular dynamics simulations (MD) and experimental characterizations. Our findings indicate that the size effect on thermal conductivity at 300 K is negligible when the thickness of SiCOH film is less than 20 nm. Additionally, we observe a contrasting temperature dependence law for the thermal conductivity of SiCOH thin films compared to crystal SiO2 thin films. Furthermore, we demonstrate a significant decrease in thermal conductivity with increasing porosity in SiCOH films; specifically, an increase in porosity from 5.35% to 42.77% results in a 60% reduction in thermal conductivity. Moreover, we validate our simulation results by characterizing the thermal conductivity of SiCOH using 3 method.