热等静压对激光粉末床熔融加工 CM247LC 不同裂纹模式的影响:考虑后处理的替代工艺参数

IF 1.9 4区 工程技术 Q2 Engineering
Jageon Koo, Joo Eon Kim, Ulanbek Auyeskhan, Seongwon Park, Im Doo Jung, Namhun Kim
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引用次数: 0

摘要

使用激光粉末床熔融(LPBF)制造的镍基超合金(包括 CM247LC)容易出现裂纹。这些裂纹会大大降低 LPBF 制造部件的可制造性;因此,选择适当的工艺参数至关重要。在大规模应用中,由于热能积累和热传导率低,标准的样品级 LPBF 参数通常会导致开裂。因此,必须探索工业规模的参数和后处理方法,如热等静压(HIP),以减少开裂。然而,在高体积能量密度(VED)条件下制造的样品可能会降低 HIP 的效果。本研究探讨了 HIP 对在各种 VED 条件(43.65-159.72 J/mm3)下制造的 CM247LC 样品的影响。研究发现了两种不同的裂纹模式,即在高和低 VED 条件下分别出现的凝固和液化裂纹。通过比较 HIP 前和 HIP 后的裂纹密度发现,在低 VED 和高 VED 条件下,HIP 的裂纹愈合效果分别约为 90% 和 47%。研究还分析了闭合裂缝(主要是液化裂缝)愈合背后的机理。这项研究为在低 VED 范围内选择 LPBF 工艺参数以减轻裂纹提供了新的见解,并对 HIP 处理愈合两种类型裂纹的效果进行了定量分析。这些发现对于能源、航空航天和汽车等工程领域的实际应用至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Influence of Hot Isostatic Pressing on Different Crack Modes of Laser Powder Bed Fusion-Processed CM247LC: Alternative Process Parameters Considering Post-processing

Influence of Hot Isostatic Pressing on Different Crack Modes of Laser Powder Bed Fusion-Processed CM247LC: Alternative Process Parameters Considering Post-processing

Nickel-based superalloys, including CM247LC, fabricated using laser powder bed fusion (LPBF) are prone to cracking. These induced cracks significantly reduce a manufacturability of the LPBF fabricated components; therefore, selecting appropriate process parameters is critical. Standard sample-scale LPBF parameters often lead to cracking in large-scale applications due to thermal energy accumulation and low thermal conductivity. Thus, it is important to explore industrial-scale parameters and post-processing methods, such as hot isostatic pressing (HIP), to mitigate cracking. However, the effectiveness of HIP can be reduced in samples fabricated under high volumetric energy density (VED) conditions. This study examines the impact of HIP on CM247LC samples fabricated under various VED conditions (43.65–159.72 J/mm3). Two distinct crack modes were identified, namely, solidification and liquation cracks at high and low VED conditions, respectively. A comparison of the pre- and post-HIP crack densities revealed that the crack healing effect of HIP under low and high VED conditions was approximately 90 and 47%, respectively. The mechanisms behind the healing of closed cracks, mostly liquation cracks, were analyzed. This study provides novel insight for selecting LPBF process parameters in the low VED range to mitigate cracks, with a quantitative analysis of HIP treatment for healing two types of cracks. These findings are crucial for practical applications in engineering fields such as the energy, aerospace, and automotive industries.

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来源期刊
CiteScore
4.10
自引率
10.50%
发文量
115
审稿时长
3-6 weeks
期刊介绍: The International Journal of Precision Engineering and Manufacturing accepts original contributions on all aspects of precision engineering and manufacturing. The journal specific focus areas include, but are not limited to: - Precision Machining Processes - Manufacturing Systems - Robotics and Automation - Machine Tools - Design and Materials - Biomechanical Engineering - Nano/Micro Technology - Rapid Prototyping and Manufacturing - Measurements and Control Surveys and reviews will also be planned in consultation with the Editorial Board.
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