Static and dynamic analyses and multi-objective optimization of wafer thinning machine’s design variables

In order to meeting the physical strength, heat dissipation and dimensional requirements of chips, the wafer surface needs to be thinned by wafer thinning machines. In the design of wafer thinning machine, the analysis and optimization of castings is an important and complex issue. In this study, the multi-objective optimization of wafer thinning machine’ s design variables are executed due to static and dynamic analyses. According to the analysis results, the design quality, amplitude and equivalent stress of the casting are optimized. The inner diameter of the ring, the height of the ring, the height of the middle groove, and the height of the groove on both sides are selected as the main design variables of the optimization. The results show that the static deformation of the optimized cast structure is 8% lower than the original structure, the overall mass is 4% lower, the operating frequency is 3.5% lower, higher stability, smaller mass and amplitude are obtained after optimization. The research has a great significance for the wafer thinning machines design, and provides theoretical guidance for the development of other lithography equipments.