通过中央振膜驱动和滤波器集成提高压电 MEMS 微型扬声器的带宽

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chia-Hao Lin, Ting-Chou Wei, Chin Tseng, Zih-Song Hu, Mei-Feng Lai, Weileun Fang
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引用次数: 0

摘要

本研究介绍的压电微型扬声器设计由中央振膜、连接弹簧和悬臂板驱动器组成,可在所需频率范围内产生两个共振。除悬臂板激励器外,还设计了电气线路和压电薄膜,以独立驱动中央振膜。根据微型扬声器结构上低频和高频模式的应力分布,设计并实现了全通滤波电路,以管理中央振膜输入信号的相位,从而改变拟议设计的运动。因此,1 kHz 以上的声压级 (SPL) 得到了改善,并避免了特定频率范围内的 SPL 为零。因此,拟议的微型扬声器实现了带宽增强。在标准耳模拟器中以 9 VDC 驱动电压在 0.707 Vrms 下进行测量,以评估所提设计的性能。同时还采用了中央振膜上没有压电薄膜的参考设计进行比较。测量结果表明,在低频范围(4 kHz 之前),由于中央振膜的激励作用,拟议设计的声压级提高了 3 分贝以上。此外,与参考设计相比,建议的设计可防止在 10 kHz 附近(低频和高频模式之间)出现声压级为零的情况,并实现超过 15 dB 的声压级增强。当驱动频率超过较高模式(14 kHz)时,带有全通滤波器的拟议设计消除了声压级零点(16.8 kHz 处),在 15-18 kHz 频率范围内增强了近 8 dB。因此,本研究证明了采用中央振膜驱动和全通滤波器集成的拟议微型扬声器设计可增强带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bandwidth enhancement of piezoelectric MEMS microspeaker via central diaphragm actuation and filter integration
This study presents the piezoelectric microspeaker design consisted of the central-diaphragm, connecting-spring, and cantilever-plate actuators to create two resonances in the desired frequency range. In addition to the cantilever-plate actuator, the electrical routing and piezoelectric film are designed to drive the central-diaphragm independently. According to the stress distributions on the microspeaker structure for both lower and higher modes, the all-pass filter circuit is designed and implemented to manage the phase of input signals to the central-diaphragm, thereby changing the motion of the proposed design. Thus, the sound pressure level (SPL) beyond 1 kHz is improved and the SPL zero at specific frequency range is avoided. As a result, the bandwidth enhancement is achieved by the proposed microspeaker. Measurements are conducted under 0.707 Vrms with 9 VDC driving voltage in standard ear simulator to evaluate the performances of the proposed design. A reference design without a piezoelectric film on the central-diaphragm is also implemented for comparison. Measurements indicate, in the low frequency range (before 4 kHz), the proposed designs have over 3 dB SPL enhancement due to the excitation of central-diaphragm. Moreover, compared to the reference design, proposed designs prevent the occurrence of an SPL zero near 10 kHz (between lower and higher modes) and achieve over 15 dB SPL enhancement. When the driving frequency exceeds the higher mode (14 kHz), the proposed design with the all-pass filter eliminates the SPL zero (at 16.8 kHz) with nearly 8 dB enhancement in the 15–18 kHz frequency range. Thus, this study demonstrates the bandwidth enhancement by the proposed microspeaker design with central-diaphragm actuation and all-pass filter integration.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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