使用叉形和环形致动器的 3.8 × 3.8 mm2 紧凑型压电谐振 MEMS 扫描仪

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuki Okamoto, Rihachiro Nakashima, Ryo Oda, Sucheta Gorwadkar, Yusuke Takei, Hironao Okada
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引用次数: 0

摘要

本研究提出了一种紧凑型 3.8 × 3.8 mm2 谐振压电微机电系统扫描仪,具有 1.0 mm 镜面和双耦合框架。它采用了两种 Pb(Zr,Ti)O3 压电致动器(叉形和环形)的新型机械耦合。这种双致动器配置提高了每个芯片的致动器面积使用效率,并通过其机械耦合显著提高了谐振频率。此外,这种设计策略还能使扫描频率高于其他模式,从而有效降低机械应力。利用 25.2 V 的单极驱动电压,拟议扫描仪的谐振频率为 27.09 kHz,光学扫描角度为 40∘。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3.8 × 3.8 mm2 compact piezoelectric resonant MEMS scanner using fork-shaped and ring-shaped actuators
This study presents a compact 3.8 × 3.8 mm2 resonant piezoelectric micro-electro-mechanical systems scanner featuring a 1.0 mm mirror and double-coupling frames. It employs a novel mechanical coupling of two Pb(Zr,Ti)O3 piezoelectric actuators–fork-shaped and ring-shaped. This dual-actuator configuration enhances the efficiency of actuator area usage per die and significantly improves the resonant frequency through their mechanical coupling. Additionally, the design strategy effectively reduces mechanical stress by operating the scanning frequency above those of other modes. The resonant frequency achieved by the proposed scanner is 27.09 kHz, with an optical scan angle of 40, utilizing a unipolar driving voltage of 25.2 V.
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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